Realistic and efficient simulation of electro-thermal effects in VLSI circuits

IEEE Transactions on Very Large Scale Integration (VLSI) Systems

Volumn 5, Issue 3, 1997, Pages 283-289

  Sabry, Mohamed Nabil ^a   Bontemps, Anne ^a   Aubert, Veronique ^a   Vahrmann, Reinhold ^b  

^a ANACAD   (France)

^b TEMIC ^*  (Germany)

Author keywords

Electro thermal; Extraction; Simulation; Thermal network

Indexed keywords

COMPUTATIONAL COMPLEXITY; COMPUTER SIMULATION; INTEGRATED CIRCUIT TESTING; THERMAL EFFECTS; THREE DIMENSIONAL;

ELECTROTHERMAL SIMULATION;

VLSI CIRCUITS;

EID: 0031233261     PISSN: 10638210     EISSN: None     Source Type: Journal    
DOI: 10.1109/92.609871     Document Type: Article

References (12)

1. E. Schurack, T. Latzel, W. Rupp, and A. Gottwald, "Nonlinear effect in transistors caused by thermal power feedback: Simulation and modeling in SPICE," in Proc. IEEE EURO-DAC 1992, 1992, pp. 879-882.
2. L. Ebrardt, G. Jacquemod, B. Boutherin, and M. Le Helley, "Simulation of electrothermal interaction in power integrated systems," in Proc. Eighth IEEE SEMI-THERM Symp., 1992, pp. 76-82.
3. S. S. Lee and D. J. Allstot, "Electrothermal simulation of integrated circuits," IEEE J. Solid State Circuits, vol. 28, pp 1283-1293, Dec. 1993.
4. V. A. Koval, A. I. Ostapchuk, I. V. Farmaga, and D. V. Fedasyuk, "CAD: The numerical and analytical methods combined for the analysis of IC's thermal fields," in Proc. IEEE DAC 1993, pp. 290-293.
5. V. Szekely, A. Poppe, M. Rencz, A. Csendes, and A. Pahi, "Self-consistent electrothermal simulation: Fundamentals and practice," in Proc. THERMINIC 1995, 1995, pp. 188-194.
6. W. K. Chu and W. H. Kao, "A three dimensional transient electrothermal simulation system for IC's," in Proc. THERMINIC 1995, 1995, pp. 201-207.
7. H. Brand and S. Selberherr, "Two-dimensional simulation of thermal runaway in a nonplanar GTO-thyristor," IEEE Trans. Electron Devices, vol. 42, pp. 2137-2146, Dec. 1995.
8. L. Litsios, B. Schmithusen, and W. Fichtner, "Thermal mixed mode device and circuit similation," in Proc. THERMINIC, 1995, pp. 195-200.
9. T. M. Eldo, User Manual, ANACAD Electrical Engineering Software, copyright 1991.
10. M. Berger and Z. Chai, "Estimation of heat transfer in SOI-MOSFET's," IEEE Trans. Electron Devices, vol. 38, pp. 871-875, Apr. 1991.
11. C. A. Brebbia, J. C. F. Telles, L. C. Wrobel, Boundary Elements Techniques: Theory and Applications in Engineering. New York: Springer-Verlag, 1984, pp. 464.
12. C. Lasance, H. Vinke, and H. Rosten, "Thermal characterization of electronic devices with boundary condition independant compact models," IEEE Trans. Comp., Packag., Manufact. Technol. A, vol. 18, Dec., 1995.