Design and CAD for 3D integrated circuits

Proceedings - Design Automation Conference

Volumn , Issue , 2008, Pages 668-673

  Franzon, Paul D ^a   Davis, W Rhett ^a   Steer, Michael B ^a   Lipa, Steve ^a   Oh, Eun Chu ^a   Thorolfsson, Thor ^a   Melamed, Samson ^a   Luniya, Sonali ^a   Doxsee, Tad ^b   Berkeley, Stephen ^b   Shani, Ben ^b   Obermiller, Kurt ^b  

^a NORTH CAROLINA STATE UNIVERSITY   (United States)

^b PTC Inc   (United States)

Author keywords

3DIC; Thermal modeling; Through Silicon Via; TSV

Indexed keywords

3DIC; DESIGN AUTOMATION CONFERENCE; THERMAL MODELING; THROUGH SILICON VIA; TSV;

COMPUTER AIDED DESIGN; DATA STORAGE EQUIPMENT; DIGITAL INTEGRATED CIRCUITS; FAST FOURIER TRANSFORMS; INDUSTRIAL ENGINEERING; INTEGRATED CIRCUITS; SIGNAL PROCESSING; SILICON;

DESIGN;

EID: 51549098429     PISSN: 0738100X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/DAC.2008.4555903     Document Type: Conference Paper

References (11)

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