A fast algorithm for the layout based electro-thermal simulation

Proceedings -Design, Automation and Test in Europe, DATE

Volumn , Issue , 2003, Pages 1032-1037

  Rencz, M ^a   Szekely, V ^a   Poppe, A ^a  

^a BUDAPEST UNIVERSITY OF TECHNOLOGY AND ECONOMICS   (Hungary)

Author keywords

[No Author keywords available]

Indexed keywords

ANALOGUE INTEGRATED CIRCUITS; ELECTRICAL PARAMETER; ELECTRO-THERMAL SIMULATION; FREQUENCY DOMAINS; SIMULATION EXAMPLE; THERMAL STRUCTURE; TIME CONSTANT SPECTRUM; TYPICAL APPLICATION;

ALGORITHMS; COMPUTER SIMULATION; EXHIBITIONS; LINEAR INTEGRATED CIRCUITS;

ITERATIVE METHODS;

EID: 3843049413     PISSN: 15301591     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/DATE.2003.1253740     Document Type: Conference Paper

References (18)

1. W.V. Petegem et al. Electro-thermal simulation and design of integrated circuits IEEE Journal of. Solid State Circuits, SSC-29(2):143, 1994
2. W.H. Kao, W.K. Chu. ATLAS: An Integrated Thermal Layout and Simulation System of IC-s In Proc. of ED&TC?94, Paris, France, March 1994
3. Y-K. Cheng et al. ETS-A: A New Electrothermal Simulator for CMOS VLSI Circuits In Proc. of ED&TC?96, pp. 566-570, Paris, France, March 1996
4. T. Li, C.H. Tsai, S.M. Kang: Efficient Transient Electrothermal Simulation of CMOS VLSI Circuits under Electrical Overstress In Proc. of ICCAD?98,San Jose, CA, USA, 1998, pp.6-10
5. S.S. Lee, D.J. Allstot: Electrothermal simulation of integrated circuits, IEEE Journal of Solid-State Circuits, SSC-28(12):1283-1293, 1993
6. G. Digele et al. Fully coupled Dynamic Electro-Thermal Simulation IEEE Transactions on VLSI Systems, 5(3):250-257, 1997
7. M.N. Sabry et al. Realistic and Efficient Simulation of Electro-Thermal Effects in VLSI Circuits IEEE Tr. on VLSI Systems, 5(3):283-289, 1997
8. S. Wunsche, C. Claub, P. Schwarz: Electro-Thermal Circuit Simulation Using Simulator Coupling, IEEE Trans. On VLSI Systems, Vol.5,No.3, ,pp 277-282, 1997
9. V. Székely et al. Self-consistent electro-thermal simulation: Fundamentals and practice Microelectronics Journal, 28:247-262, 1997
10. V. Székely et.al.: Electro-thermal and logi-thermal simulation of VLSI designs, IEEE Transactions on VLSI Systems, 5(3):258-269, 1997
11. T. Veijola et al. An implementation of electro-thermal component models in a general purpose circuit simulation program In Proc. of the 3rd THERMINIC Workshop, pp. 96-100, Cannes, France, September 1997
12. V. Székely: Accurate calculation of device heat dynamics: A special feature of the Trans-Tran circuit analysis program, Electronics Letters,Vol 9,no.6,pp.132-134 (1973
13. V. Székely et al. SISSSI - A tool for dynamic electrothermal simulation of analog VLSI cells Proc. of ED&TC?97, p. 617, Paris, France, March 1997
14. M. Rencz et al: An alternative method for electro-thermal circuit simulation In Proc. of SSMSD?99, pp 117-122, Tucson, AZ, USA, 1999
15. L. T. Pillage, R. A. Rohrer: Asymptotic waveform evaluation for timing analysis, IEEE Transactions on Computer-Aided Design, CAD-9(4):352-366, 1990
16. V. Székely: Identification of RC Networks by Deconvolution: Chances and Limits, IEEE Transactions on Circuits and Systems-I. Theory and Applications, CAS-45(3):244-258, 1998
17. V. Székely, A. Poppe, M. Rencz, M. Rosental, T. Teszéri: THERMAN: A thermal simulation tool for IC chips, microstructures and PW boards. Microelectronics Reliability, Vol. 40, pp. 517-524, 2000
18. J.E. Solomon: The monolithic Op Amp: A tutorial, IEEE Journal of Solid-state circuits, Vol.SC-9, No. 6,Dec. 1974, pp 314-332