In situ STM study of Cu electrodeposition on TBPS-modified Au(111) electrodes

Journal of the Electrochemical Society

Volumn 159, Issue 2, 2012, Pages

  Liu, Yung Fang ^a   Krug, Klaus ^a   Lin, Pin Chun ^a   Chiu, Yong Da ^b   Dow, Wei Ping ^b   Yau, Shueh Lin ^c   Lee, Yuh Lang ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

^c NATIONAL CENTRAL UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

AU (111) SUBSTRATES; AU(1 1 1 ); CRYSTALLOGRAPHIC DIRECTIONS; CU ATOMS; CU FILMS; ELECTROCHEMICAL METHODS; GALVANOSTATICS; GROWTH MECHANISMS; IN-SITU; ISLAND GROWTH; ONE-DIMENSIONAL GROWTH; OVERPOTENTIAL DEPOSITION; PERCHLORIC ACID SOLUTIONS; SCANNING TUNNELING MICROSCOPY (STM); SODIUM SALT; SOLID/LIQUID INTERFACES; UNDERPOTENTIAL DEPOSITION;

CYCLIC VOLTAMMETRY; ELECTRODEPOSITION; ELECTRODES; ELECTROLYTES; FILM GROWTH; INORGANIC ACIDS; SCANNING TUNNELING MICROSCOPY; SURFACE DEFECTS; SURFACE ROUGHNESS;

COPPER;

EID: 84855307920     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/2.057202jes     Document Type: Article

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