Highly integrated 2-D capacitive micromachined ultrasonic transducers

Proceedings of the IEEE Ultrasonics Symposium

Volumn 2, Issue , 1999, Pages 1163-1166

  Calmes, S ^a   Cheng, C H ^a   Degertekin, F L ^a   Jin, X C ^a   Ergun, S ^a   Khuri Yakub, B T ^a  

^a STANFORD UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP DEVICES; INTEGRATED CIRCUIT LAYOUT; SILICON WAFERS; ULTRASONIC MEASUREMENT;

CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCERS; DEEP REACTIVE ION ETCHER; ELECTRICAL INTERCONNECTS; INTEGRATED CIRCUIT PROCESSING TECHNIQUES;

ULTRASONIC TRANSDUCERS;

EID: 0033296338     PISSN: 10510117     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)