Synthesis of vinyl acetate/Pd nanocomposites as activator ink for ink-jet printing technology and electroless copper plating

Journal of the Taiwan Institute of Chemical Engineers

Volumn 42, Issue 6, 2011, Pages 989-995

  Tseng, Chun Chieh ^a,b   Lin, Yeuh Hui ^c   Shu, Youn Yuen ^b   Chen, Chun Jen ^d   Ger, Ming Der ^a  

^a NATIONAL DEFENSE UNIVERSITY   (Taiwan)

^b NATIONAL KAOHSIUNG NORMAL UNIVERSITY   (Taiwan)

^c KAO YUAN UNIVERSITY   (Taiwan)

^d CHANG GUNG UNIVERSITY   (Taiwan)

Author keywords

Electroless copper; Ink jet printing; Palladium nanoparticles; Vinyl acetate

Indexed keywords

COPPER LINES; CU LAYERS; ELECTROLESS COPPER; ELECTROLESS COPPER PLATING; ELECTROLESS METAL DEPOSITION; HIGH RESOLUTION; METALLIC PALLADIUM; NOBLE METAL NANOPARTICLES; PALLADIUM NANOPARTICLES; PD NANO PARTICLE; REDUCTANTS; VINYL ACETATES;

COLLOID CHEMISTRY; COLLOIDS; COPPER; COPPER PLATING; FREE RADICAL POLYMERIZATION; FREE RADICALS; NANOPARTICLES; OLIGOMERS; ORGANOMETALLICS; PALLADIUM; POLYVINYL ACETATES; PRECIOUS METALS; SURFACE ACTIVE AGENTS; VOLATILE FATTY ACIDS;

INK JET PRINTING;

EID: 82855165179     PISSN: 18761070     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jtice.2011.05.002     Document Type: Article

References (30)

1. Noguchi Y., Sekitani T., Someya T. Organic-transistor-based flexible pressure sensors using ink-jet-printed electrodes and gate dielectric layers. Appl Phys Lett 2006, 89:253507.
2. Song D.H., Choi M.H., Kim J.Y., Jang J. Process optimization of organic thin-film transistor by ink-jet printing of DH4T on plastic. Appl Phys Lett 2007, 90:053504.
3. Guo T.F., Chang S.C., Pyo S., Yang Y. Vertically integrated electronic circuits via a combination of self-assembled polyelectrolytes, ink-jet printing, and electroless metal plating processes. Langmuir 2002, 18:8412.
4. Fix W., Ullmann A., Ficker J., Clemens W. Fast polymer integrated circuits. Appl Phys Lett 2002, 81:1735.
5. Calvert P. Inkjet printing for materials and devices. Chem Mater 2001, 13:3299.
6. Bidoki S.M., Lewis D.M., Clark M., Vakorov A., Millner P.A., McGorman D. Ink-jet fabrication of electronic components. J Micromech Microeng 2007, 17:967.
7. Nguyen B.T., Gautrot J.E., Nguyen M.T., Zhu X.X. Nitrocellulose-stabilized silver nanoparticles as low conversion temperature precursors useful for inkjet printed electronics. J Mater Chem 2007, 17:1725.
8. Dearden A.L., Smith P.J., Shin D.Y., Reis N., Derby B., Brien P.O. A low curing temperature silver ink for use in ink-jet printing and subsequent production of conductive tracks. Macromol Rapid Commun 2005, 26:315.
9. Lu C.A., Lin P., Lin H.C., Wang S.F. Characterization of the low-curing-temperature silver paste with silver 2-ethylhexanoate addition. J Appl Phys 2007, 46:251.
10. Osch van T.H.J., Perelaer J., Laat de A.W.M., Schubert U.S. Inkjet printing of narrow conductive tracks on untreated polymeric substrates. Adv Mater 2008, 20:343.
11. Lee H.H., Chou K.S., Huang K.C. Inkjet printing of nanosized silver colloids. Nanotechnology 2005, 16:2436.
12. Kamyshny A, Moshe B.M., Aviezer S., Magdassi S. Ink-jet printing of metallic nanoparticles and microemulsions. Macromol Rapid Commun 2005, 26:281.
13. Ko S.H., Pan H., Grigoropoulos C.P., Luscombe C.K., Fréchet J.M.J., Poulikakos D. All-inkjet-printed flexible electronics fabrication on a polymer substrate by low-temperature high-resolution selective laser sintering of metal nanoparticles. Nanotechnology 2007, 18:345202.
14. Perelaer J., Hendriks C.E., Laat de A.W.M., Schubert U.S. One-step inkjet printing of conductive silver tracks on polymer substrates. Nanotechnology 2009, 20:165303.
15. Kim D., Moon J. Highly conductive ink jet printed films of nanosilver particles for printable electronics. Electrochem Solid-State Lett 2005, 8:J30.
16. Bai J.G., Creehan K.D., Kuhn H.A. Inkjet printable nanosilver suspensions for enhanced sintering quality in rapid manufacturing. Nanotechnology 2007, 18:185701.
17. Kao C.Y., Chao K.S. Electroless copper plating onto printed lines of nanosized silver seeds. Electrochem Solid-State Lett 2007, 10:D32.
18. Sridhar A., Reiding J., Adelaar H., Achterhoek F., Dijk V.D.J., Akkerman R. Inkjet-printing- and electroless-plating- based fabrication of RF circuit structures on high-frequency substrates. J Micromech Microeng 2009, 19:085020.
19. Cheng K., Yang M.H., Chiu W.W.W., Huang C.Y., Chang J., Ying T.F., et al. Ink-jet printing, self-assembled polyelectrolytes, and electroless plating: low cost fabrication of circuits on a flexible substrate at room temperature. Macromol Rapid Commun 2005, 26:247.
20. Shah P., Kevrekidis Y., Benziger J. Ink-jet printing of catalyst patterns for electroless metal deposition. Langmuir 1999, 15:1584.
21. Tseng C.C., Chang C.P., Sung Y., Chen Y.C., Ger M.D. A novel method to produce Pd nanoparticle ink for ink-jet printing technology. Colloids Surf A Physicochem Eng Aspects 2009, 339:206.
22. Tseng C.C., Chang C.P., Ou J.L., Sung Y., Ger M.D. The preparation of metal-styrene oligomer and metal-SSNa nanocomposites through single thermal. Colloids Surf A Physicochem Eng Aspects 2008, 330:42.
23. Tseng C.C., Chang C.P., Ou J.L., Sung Y., Ger M.D. Noble metallic nanoparticles reduced by PS-based oligomers through one-step synthesis. Colloids Surf A Physicochem Eng Aspects 2009, 333:138.
24. Kim D.H., Jo W.H. Studies on Polymer-metl interface, 4. Effect of substituent of polymethacrylate on the interfacial characteristics between polymethacrylates and copper. Macromol Chem Phys 2001, 202:3065.
25. Meen T.H., Chen W.R., Huang C.J., Chiu C.J. Thin copper seed layers in interconnect metallization using the electroless plating process. J Appl Phys 2004, 43:5100.
26. Barnat E.V., Nagakura D., Wang P.I., Lu T.M. Real time resistivity measurements during sputter deposition of ultrathin copper films. J Appl Phys 2002, 91:1667.
27. Zhunag W.W., Charneski L.J., Evans D.R., Hsu S.T. CVD copper thin film deposition by using (1-pentene)Cu(I)(hfac). IEEE Interconnect Technol Conf 2000, 185.
28. Krongelb S., Romankiw L.T., Tornello J.A. Electrochemical process for advanced package fabrication. IBM J Res Dev 1998, 42:575.
29. Lee B., Kim Y., Yang S., Jeong I., Moon J. A low-cure-temperature copper nano ink for highly conductive printed electrodes. Curr Appl Phys 2009, 9:157.
30. Park J., Moon J. Studies on polymer-metal interfaces, 4. Effect of substituent of polymethacrylate on the interfacial characteristics between polymethacrylates and copper. Langmuir 2006, 22:3506.