CVD copper thin film deposition by using (1-pentene)Cu(I)(hfac)

Proceedings of the IEEE 2000 International Interconnect Technology Conference, IITC 2000

Volumn , Issue , 2000, Pages 185-187

  Zhuang, W W ^a   Charneski, L J ^a   Evans, D R ^a   Hsu, Sheng Teng ^a  

^a SHARP LABORATORIES OF AMERICA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL VAPOR DEPOSITION; COPPER; DEPOSITION; DEPOSITION RATES; THIN FILMS;

COPPER NUCLEI; COPPER PRECURSORS; COPPER THIN FILM; CVD PROCESS; FILM PROPERTIES; HIGH DEPOSITION RATES; LOW RESISTIVITY; PURE COPPER;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 84962828392     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2000.854320     Document Type: Conference Paper

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