Characterization of the low-curing-temperature silver paste with silver 2-ethylhexanoate addition

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 46, Issue 1, 2007, Pages 251-255

  Lu, Chun An ^a   Lin, Pang ^a   Lin, Hong Ching ^a   Wang, Sea Fue ^b  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^b NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY   (Taiwan)

Author keywords

Metallo organic decomposition; Resistivity; Silver paste; Thermal behavior

Indexed keywords

CURING; MICROSTRUCTURE; PYROLYSIS; THERMAL EFFECTS;

METALLO-ORGANIC DECOMPOSITION; SILVER PASTE; THERMAL BEHAVIOR;

SILVER;

EID: 34547834088     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.46.251     Document Type: Article

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