Preparation of silane modified SiO2 abrasive particles and their Chemical Mechanical Polishing (CMP) performances

Wear

Volumn 273, Issue 1, 2011, Pages 100-104

  Pan, GuoShun ^a   Gu, ZhongHua ^a   Zhou, Yan ^a   Li, Tuo ^a   Gong, Hua ^a   Liu, Yan ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

Chemical Mechanical Polishing (CMP); Silicon wafer; SiO2

Indexed keywords

ABRASIVE PARTICLES; AMINOPROPYL; AQUEOUS ENVIRONMENT; FTIR; MODIFIED SILICA PARTICLES; POLISHING RATE; POTENTIAL ANALYSIS; SILICON PARTICLES; SIO2; SURFACE-MODIFIED; THERMAL GRAVIMETRIC ANALYSIS; TRIETHOXYSILANE; TRIMETHOXYSILANE;

ABRASIVES; DIFFERENTIAL SCANNING CALORIMETRY; FOURIER TRANSFORM INFRARED SPECTROSCOPY; GRAVIMETRIC ANALYSIS; POLISHING; SEMICONDUCTING SILICON COMPOUNDS; SILANES; SILICA; SILICON OXIDES; SILICON WAFERS; THERMOGRAVIMETRIC ANALYSIS;

CHEMICAL MECHANICAL POLISHING;

EID: 82455167879     PISSN: 00431648     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.wear.2011.05.044     Document Type: Article

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