Effects of defects on the thermal and optical performance of high-brightness light-emitting diodes

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 32, Issue 4, 2009, Pages 233-240

  Tan, Liuxi ^a   Li, Jia ^a   Wang, Kai ^b   Liu, Sheng ^b  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

Cracks; Defects; Delaminations; Light extraction efficiency; Light emitting diode (LED); Reliability; Thermal resistance

Indexed keywords

ACCELERATED TESTING; DIE ATTACHMENT; FIELD APPLICATION; HIGH BRIGHTNESS; LIGHT EXTRACTION EFFICIENCY; LIGHT-EMITTING DIODE (LED); MANUFACTURING PROCESS; NON-LINEARITY; NONLINEAR FINITE ELEMENT METHOD; NONUNIFORM LOAD; OPTICAL DISCONTINUITY; OPTICAL PERFORMANCE; PROCESS DEVELOPMENT; SIMULATION RESULT; STRESS FORCE; THERMAL CONTACT RESISTANCE; THERMAL RESISTANCE;

CONTACTS (FLUID MECHANICS); CRACKS; CURRENT DENSITY; DELAMINATION; DIODES; EXTRACTION; LIGHT EMISSION; OPTICAL DEVICES;

LIGHT EMITTING DIODES;

EID: 70350341510     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2009.2027893     Document Type: Article

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