Thermal transient analysis of LED array system with in-line pin fin heat sink

2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011

Volumn , Issue , 2011, Pages

  Hou, Fengze ^a   Yang, Daoguo ^a   Zhang, G Q ^a,b   Hai, Yang ^a   Liu, Dongjing ^a   Liu, Lei ^a  

^a GUILIN UNIVERSITY OF ELECTRONIC TECHNOLOGY   (China)

^b DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFERENTIAL STRUCTURE; ELECTRICAL TESTS; FINITE ELEMENT SIMULATIONS; HEAT DISSIPATION; HEAT FLOW PATH; HIGH POWER LED; IN-LINE; JUNCTION TEMPERATURES; LED ARRAYS; PIN FIN HEAT SINKS; SIMULATION RESULT; THERMAL RESISTANCE; THERMAL TRANSIENT ANALYSIS;

EXPERIMENTS; FINS (HEAT EXCHANGE); FUEL TANKS; HEAT RESISTANCE; MICROELECTRONICS; MICROSYSTEMS; TRANSIENT ANALYSIS;

LIGHT EMITTING DIODES;

EID: 79957892451     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2011.5765844     Document Type: Conference Paper

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