Self-aligned mask renewal for anisotropically etched circular micro- and nanostructures

Journal of Micromechanics and Microengineering

Volumn 21, Issue 11, 2011, Pages

  Kaspar, Peter ^a   Holzapfel, Sebastian ^a   Windhab, Erich J ^a   Jäckel, Heinz ^a  

^a ETH ZURICH   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

DROPLET FORMATION; DRY ETCHING PROCESS; ENGINEERING FIELDS; ETCHED HOLES; ETCHING MASKS; ETCHING STEP; FOOD ENGINEERING; HARDMASKS; HIGH ASPECT RATIO; INP; LINE-OF-SIGHT DEPOSITION; MASKING LAYERS; MEMBRANE STABILITY; MICRO AND NANOSTRUCTURES; POSITIVE-TONE RESISTS; PROOF OF PRINCIPLES; SELF-ALIGNED; SILICON NITRIDE MEMBRANE; TOP-DOWN FABRICATION;

DRY ETCHING; INDIUM PHOSPHIDE; NANOSTRUCTURES; PHOTONIC CRYSTALS; SILICON NITRIDE; TITANIUM; TITANIUM NITRIDE;

ASPECT RATIO;

EID: 80555138830     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/21/11/115003     Document Type: Article

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