Transient liquid phase diffusion bonding Al-6061 using nano-dispersed Ni coatings

Materials and Design

Volumn 33, Issue 1, 2012, Pages 469-475

  Cooke, Kavian O ^a   Khan, Tahir I ^a   Oliver, Gossett D ^b  

^a UNIVERSITY OF CALGARY   (Canada)

^b UNIVERSITY OF TECHNOLOGY   (Jamaica)

Author keywords

A. Metal matrix composite; D. Diffusion bonding; H. Failure analysis

Indexed keywords

ALUMINA PARTICLES; BONDING TEMPERATURES; D. DIFFUSION BONDING; EUTECTIC FORMATION; H. FAILURE ANALYSIS; INTERMETALLIC PHASIS; ISOTHERMAL SOLIDIFICATION; JOINT FORMATION; JOINT INTERFACES; JOINT STRENGTH; JOINT ZONE; METAL MATRIX COMPOSITES; NANO-SIZE; NI COATING; SOLID-STATE DIFFUSION; TRANSIENT LIQUID-PHASE DIFFUSION BONDING;

DIFFUSION BONDING; DIFFUSION COATINGS; DIFFUSION IN SOLIDS; DISPERSION (WAVES); FAILURE ANALYSIS; LIQUIDS; METALLIC MATRIX COMPOSITES; SCANNING ELECTRON MICROSCOPY; SOLIDIFICATION; WAVELENGTH DISPERSIVE SPECTROSCOPY; X RAY DIFFRACTION;

ALUMINUM;

EID: 80054008593     PISSN: 02641275     EISSN: 18734197     Source Type: Journal    
DOI: 10.1016/j.matdes.2011.04.051     Document Type: Article

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