Diffusion bonding of an aluminium-copper alloy reinforced with silicon carbide particles (AA2014/SiC/13p) using metallic interlayers

Scripta Materialia

Volumn 35, Issue 11, 1996, Pages 1285-1293

  Urena A ^a   Gomez De Salazar J M ^a   Escalera, M D ^a  

^a UNIVERSIDAD COMPLUTENSE DE MADRID   (Spain)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM ALLOYS; ASPECT RATIO; BONDING; DIFFUSION; FAILURE ANALYSIS; JOINTS (STRUCTURAL COMPONENTS); SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH; TRANSMISSION ELECTRON MICROSCOPY;

ALUMINUM LITHIUM ALLOYS; DIFFUSION BONDING; FRACTOGRAPHIC STUDIES;

METALLIC MATRIX COMPOSITES;

EID: 0030408704     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/1359-6462(96)00310-7     Document Type: Article

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