Reactive diffusion bonding of SiCp/Al composites by insert layers of mixed powders

Materials Science and Technology

Volumn 21, Issue 10, 2005, Pages 1217-1221

  Huang, J H ^a   Dong, Y L ^a   Wan, Y ^a   Zhang, J G ^a   Zhou, G A ^a  

^a UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING   (China)

Author keywords

Insert layer; Reactive diffusion bonding; SiCp Al MMCs

Indexed keywords

DIFFUSION; INTERMETALLICS; POWDER METALS; REINFORCEMENT; SEGREGATION (METALLOGRAPHY); SILICON CARBIDE;

INSERT LAYER; REACTIVE DIFFUSION BONDING; SICP/AL MMC;

METALLIC MATRIX COMPOSITES;

EID: 27544495513     PISSN: 02670836     EISSN: None     Source Type: Journal    
DOI: 10.1179/174328405X51631     Document Type: Article

References (13)

1. A. Urena, M. D. Escalera and L. Gil: Compos. Sci. Technol., 2000, 60, 613-622.
2. M. A. Chen, C. S. Wu and J. G. Wang: Trans. China Weld. Inst., 2003, 24, 69-72.
3. P. P. Lean, L. Gil and A. Urena: J. Mater. Process. Technol., 2003, 143-144, 846-850.
4. R. Y. Huang, S. C. Chen and J. C. Huang: Metall. Mater. Trans. A: Phys. Metall. Mater. Sci., 2001, 32, 2575-2584.
5. R. Gurler: J. Mater. Sci. Lett., 1998, 17, 1543-1544.
6. T. J. Lienert, J. M. K. Wiezorek and H. L. Fraser: Proc. Conf. on 'Joining of advanced and specialty materials', 117-126; 1998, Metals Park, OH, ASM International.
7. X. P. Zhang, L. Ye and Y. W. Mai: Composites A: Appl. Sci. Manuf., 1999, 30, 1415-1421.
8. M. J. Zhao, L. Q. Chen and J. Bi: J. Mater. Sci. Technol., 2000, 16, 471-474.
9. X. P. Zhang, G. F. Quan and W. Wei: Composites A: Appl. Sci. Manuf., 1999, 30, 823-827.
10. A. Urena, M. D. Escalera and M. I. Femandez: Weld. J., 1997, 76, 92-102.
11. J. Niu, D. Zhang and G. Ji: Rare Met., 2002, 21, 123-126.
12. R. Klehn and T. W. Eaqer: Weld. Res. Council Bull., 1993, 385, 1-26.
13. A. Shirzadi and E. R. Wallach: Mater. Sci. Forum, 2000, 329-330, 351-360.