Diffusion welding of SiCp/2014Al composites using Ni as interlayer

Journal of University of Science and Technology Beijing: Mineral Metallurgy Materials (Eng Ed)

Volumn 13, Issue 3, 2006, Pages 267-271

  Feng, Tao ^a   Chen, Xizhang ^a,b   Wu, Luhai ^a   Lou, Songnian ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

^b JIANGSU UNIVERSITY   (China)

Author keywords

Aluminum matrix composite; Diffusion bonding; Interface diffusion; Vacuum diffusion welding

Indexed keywords

DIFFUSION; INTERMETALLICS; MICROSTRUCTURE; NICKEL; SILICON CARBIDE; SOLDERED JOINTS; WELDING;

ALUMINUM MATRIX COMPOSITE; DIFFUSION BONDING; INTERFACE DIFFUSION; VACUUM DIFFUSION WELDING;

METALLIC MATRIX COMPOSITES;

EID: 33747383081     PISSN: 10058850     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1005-8850(06)60056-X     Document Type: Article

References (11)

1. A. Urena, M.D. Escalera, and L. Gil, Influence of interface reactions on fracture mechanisms in TIG arc-welded aluminum matrix composites, Compos. Sci. Technol., 60 (2000), No. 3, p. 613.
2. L.M. Liu, J.T. Niu, and Y.H. Tian, Study of interface reaction and effecting factor of aluminum matrix composite under laser welding condition, Mater. Technol., 1999, No. 4, p. 38.
3. A. Urena, J.M. Gomez de Salazar, and M.D. Escalera, Influence of metal-ceramic interfaces on the behaviour of metal matrix composites and their joints, Key Eng. Mater., 1997, No. (127-131), p. 687.
4. W.H. Liu, D.Q. Sun, X.M. Qiu, et al., A study of transient liquid phase bonded aluminum matrix composite, Mater. Technol., 1999, No. 4, p. 21.
5. R.Q. Xu, J.S. Zou, and Y.S. Han, Brazing technology of aluminum matrix composite, Weld. Technol., 31 (2002), No. 3, p. 1.
6. L.M. Liu, M.L. Zhu, L.G. Pan, et al., Studying of micro-bonding in diffusion welding joint for composite, Mater. Sci. Technol. A, 315 (2001), No. 9, p. 103
7. Y.L. Chen, L.G. Yu, and H.M. Wang, Effect of alloying filler metal addition on microstructure of laser beam welded SiCp/6061Al MMC, Acta Mater. Compos. Sin., 17 (2000), No. 4, p. 63.
8. V.H. Garcia, P.M. Mors, and C. Scherer, Kinetics of phase formation in binary thin films: the Ni/Al case, Acta Meter., 2002, No. 48, p. 1201.
9. G.A. Lopez, S. Sommadossi, P. Zieba, et al., Kinetic behaviour of diffusion-soldered Ni/Al/Ni interconnections, Mater. Chem. Phys., 2002, No. 78, p. 459.
10. M.S.A. Karunaratne, P. Carter, and R.C. Reed, On the diffusion of aluminum and titanium in the Ni-rich Ni-Al-Ti system between 900 and 1200°C, Acta Mater., 2001, No. 49, p. 861.
11. T.H. Zhang, Y.G. Wu, Y.W. Zhang, et al., Phase transition and diffusion of Ni atoms in aluminum during implantation, Vacuum, 2002, No. 65, p. 127.