Joining of aluminium metal matrix composites

Materials and Manufacturing Processes

Volumn 20, Issue 4, 2005, Pages 717-726

  Pal, Tapan Kumar ^a  

^a JADAVPUR UNIVERSITY   (India)

Author keywords

6061 Aluminium alloy matrix; AlMMCs; Bonding parameters; Cu interlayer; Diffusion layer; Epitaxial growth; Eutectic liquid; Extruded rod; Fracture surface; Intel metallic compound; Isothermal solidification; Microhardness; Shear strength; SiC particulate

Indexed keywords

6061 ALUMINIUM ALLOY MATRIX; AIMMCS; BONDING PARAMETERS; CU INTERLAYERS; DIFFUSION LAYERS; EUTECTIC LIQUID; EXTRUDED ROD; FRACTURE SURFACE; ISOTHERMAL SOLIDIFICATION; SIC PARTICULATE;

ALUMINUM ALLOYS; BONDING; COMPOSITE MATERIALS; EPITAXIAL GROWTH; GRAIN SIZE AND SHAPE; INTERMETALLICS; ISOTHERMS; JOINING; METALLOGRAPHY; MICROHARDNESS; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH; SOLIDIFICATION; X RAY DIFFRACTION;

METALLIC MATRIX COMPOSITES;

EID: 23144455017     PISSN: 10426914     EISSN: 15322475     Source Type: Journal    
DOI: 10.1081/AMP-200055116     Document Type: Article

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