Joining of high-strength aluminum-based materials with tin-based solders

Welding Journal (Miami, Fla)

Volumn 87, Issue 3, 2008, Pages 35-37

  Weis, S ^a   Hoyer, I ^a   Wielage, B ^a  

^a CHEMNITZ UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

GRAIN GROWTH; MECHANICAL ALLOYING; MELTING POINT; SOLDERED JOINTS; TIN;

ALUMINA PARTICLES; ALUMINUM-BASED MATERIALS; SOLDER COMPOSITION;

SOLDERING ALLOYS;

EID: 40749101582     PISSN: 00432296     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (7)

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3. Wielage, B. 2006. Special research area (SFB) 692, High-strength aluminum based lightweight materials for reliable components, TU Chemnitz, German research association, Bonn (DFG).
4. Weis, S. 2006. Effects of particle reinforcement on the strength behavior of tin-based soldered aluminum matrix composites. Thesis (diploma), TU Chemnitz.
5. Klose, H. 1999. Beitrag zur Berechnung, Herstellung und Charakterisierung von verstärkten Aktivloten. German dissertation. TU Chemnitz. ISBN: 1439-1597.
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7. Wielage, B., Irommer, F., Hielscher, H., and Mücklich, S. 2001. Neue Entwicklungen auf dem Gebiet des Ultraschalllötens. In: DVS-Berichte: Hart- und Hochtemperaturlöten und Diffusionsschweißen. Bd. 212. Düsseldorf, Germany, 3-87155-670-X, pp. 236-239.