Grain boundary segregation and interdiffusion effects in nickel-copper alloys: An effective means to improve the thermal stability of nanocrystalline nickel

ACS Applied Materials and Interfaces

Volumn 3, Issue 7, 2011, Pages 2265-2274

  Pellicer, Eva ^a   Varea, Aïda ^a   Sivaraman, Kartik M ^c   Pané, Salvador ^c   Surinach, Santiago ^a   Baró, Maria Dolors ^a   Nogués, Josep ^b,d   Nelson, Bradley J ^c   Sort, Jordi ^a,d  

^a UNIVERSITAT AUTÒNOMA DE BARCELONA   (Spain)

^b CATALAN INSTITUTE OF NANOSCIENCE AND NANOTECHNOLOGY ICN2   (Spain)

^c ETH ZURICH   (Switzerland)

^d INSTITUCIÓ CATALANA DE RECERCA I ESTUDIS AVANÇATS ICREA   (Spain)

Author keywords

anocrystalline; hardness; hermal stability; lectrodeposition; magnetic properties; nickel opper alloy

Indexed keywords

ANNEALED STATE; ANOCRYSTALLINE; ELECTROACTIVE SPECIES; ELECTROLYTIC BATHS; GRAIN BOUNDARY SEGREGATION; GRAIN REFINING; HERMAL STABILITY; INTERDIFFUSION EFFECTS; LECTRODEPOSITION; LOW TEMPERATURES; MINIATURIZED DEVICES; NANO-CRYSTALLINE NICKEL; NANOCRYSTALLINES; NI FILMS; NICKEL-COPPER ALLOYS; NICKEL-OPPER ALLOY; SHIELDING LAYER; SOFT MAGNETICS; SULFATE SALTS;

ANNEALING; COPPER; GRAIN BOUNDARIES; GRAIN GROWTH; GRAIN SIZE AND SHAPE; HARDNESS; MAGNETIC PROPERTIES; NICKEL; SEGREGATION (METALLOGRAPHY); THERMODYNAMIC STABILITY;

NANOCRYSTALLINE ALLOYS;

EID: 80053648624     PISSN: 19448244     EISSN: 19448252     Source Type: Journal    
DOI: 10.1021/am2004587     Document Type: Article

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