Copper passivation of boron in Si1-xGex alloys and boron reactivation kinetics

Microelectronic Engineering

Volumn 55, Issue 1-4, 2001, Pages 323-328

  Barthula, M ^a   Aboelfotoh, M O ^b   Meyer, F ^a  

^a UNIVERSITÉ PARIS SACLAY   (France)

^b North Carolina State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPRESSIVE STRESS; COPPER; DIFFUSION; PASSIVATION; REACTION KINETICS; SEMICONDUCTING BORON; SEMICONDUCTING SILICON COMPOUNDS; STRAIN;

REACTIVATION KINETICS;

SEMICONDUCTING FILMS;

EID: 0034823542     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(00)00463-9     Document Type: Article

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