Observations on diffusion-induced recrystallization in binary Ni/Cu diffusion couples annealed at an intermediate temperature

Materials Science and Engineering: A

Volumn 312, Issue 1-2, 2001, Pages 176-181

  Yamamoto, Y ^a   Uemura, S ^a   Kajihara, M ^a  

^a TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

Cu Ni; Diffusion induced recrystallization; Grain boundary migration; Grain growth

Indexed keywords

ANNEALING; COPPER; DIFFUSION; NICKEL; SINGLE CRYSTALS;

PROPORTIONALITY COEFFICIENTS;

CRYSTALLIZATION;

PHASE CHANGE;

EID: 0035882654     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5093(00)01889-X     Document Type: Article

References (17)