Indentation size dependent plastic deformation of nanocrystalline and ultrafine grain Cu films at nanoscale

Journal of Applied Physics

Volumn 105, Issue 8, 2009, Pages

  Cao, Z H ^a   Lu, H M ^a   Meng, X K ^a   Ngan, A H W ^b  

^a NANJING UNIVERSITY   (China)

^b UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

CONTACT DEPTHS; CREEP DEFORMATIONS; CREEP STRAIN RATES; CREEP TESTS; CU FILMS; DEPTH RANGES; GRAIN SIZES; GRAIN-BOUNDARY; INDENTATION SIZE EFFECTS; INDENTATION SIZES; NANO-CRYSTALLINE; NANO-SCALE; STRAIN-RATE SENSITIVITIES; ULTRA-FINE GRAINS;

COPPER; CREEP; METALLIC FILMS; NANOCRYSTALLINE MATERIALS;

STRAIN RATE;

EID: 65449181535     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3110087     Document Type: Article

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