Immersion cooling nucleate boiling of high power computer chips

Energy Conversion and Management

Volumn 53, Issue 1, 2012, Pages 205-218

  El Genk, Mohamed S ^a  

^a MSC01 1070   (United States)

Author keywords

Critical heat flux; Dielectric liquids; Electronics cooling; High power computer chips; Immersion cooling spreaders; Nucleate boiling

Indexed keywords

BOILING HEAT-TRANSFER COEFFICIENTS; COMPUTER CHIPS; CU SUBSTRATE; ELECTRONICS COOLING; EXPERIMENTAL CURVES; EXPERIMENTAL DATA; HIGH-POWER; IMMERSION COOLING; IMMERSION COOLING SPREADERS; LIQUID SUBCOOLING; PLANE SURFACES; POROUS GRAPHITE; POTENTIAL APPLICATIONS; STANDBY MODE; SUB-COOLED BOILING; SURFACE HEAT FLUXES; SURFACE INCLINATION; SURFACE LAYERS; THERMAL POWER;

COOLING; FACINGS; HEAT FLUX; HEAT TRANSFER COEFFICIENTS; NANOCOMPOSITE FILMS; NATURAL CONVECTION; NUCLEATE BOILING; PHASE TRANSITIONS; SPREADERS; THERMOANALYSIS;

DIELECTRIC LIQUIDS;

EID: 80053345616     PISSN: 01968904     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.enconman.2011.08.008     Document Type: Article

References (47)

1. M.S. El-Genk, and H. Bostanci Saturation boiling of HFE-7100 from a copper surface, simulating a microelectronic chip Int J Heat Mass Transfer 46 10 2003 1841 1854 (Pubitemid 36270379)
2. M.S. El-Genk, and H. Bostanci Combined effects of subcooling and surface orientation on pool boiling of HFE-7100 from a simulated electronic chip J Exp Heat Transfer 16 4 2003 281 301
3. J.Y. Chang, S.M. You, and A. Haji-Sheikh Film boiling incipience at the departure from natural convection on flat, smooth surfaces J Heat Transfer 120 2 1998 402 408
4. McNiel A. Pool boiling critical heat flux in a highly wetting liquid. Masters thesis, University of Minnesota, Minneapolis, MN; 1992.
5. Z.W. Liu, W.W. Lin, D.J. Lee, and X.F. Peng Pool boiling of FC-72 and HFE-7100 J Heat Transfer 123 2 2001 399 400 (Pubitemid 32706928)
6. J.L. Parker, and M.S. E-Genk Saturation and subcooled boiling of HFE-7100 on pinned surfaces at different orientations J Thermophys Heat Transfer 23 2 2009 381 391
7. Y.Y. Jiang, W.C. Wang, D. Wang, and B.X. Wang Boiling heat transfer on machined porous surfaces with structural optimization Int J Heat Mass Transfer 44 2 2001 443 456
8. R.L. Webb Odyssey of the enhanced boiling surface J Heat Transfer 126 6 2004 1051 1059 (Pubitemid 40355515)
9. K.G. Rajalu, R. Kumar, B. Mohanty, and H.K. Varma Enhancement of nucleate pool boiling heat transfer coefficient by reentrant cavity surfaces J Heat Mass Transfer 41 2 2004 127 132 (Pubitemid 40003319)
10. S. Vemuri, and K.J. Kim Pool boiling of saturated FC-72 on nano-porous surface Int Commun Heat Mass Transfer 32 1-2 2005 27 31 (Pubitemid 40318151)
11. M.S. El-Genk, and J.L. Parker Nucleate boiling of FC-72 and HFE-7100 on porous graphite at different orientations and liquid subcooling J Energy Convers Manage 49 4 2008 733 750 (Pubitemid 351625377)
12. N.K. Nimkar, S.H. Bhavnani, and R.C. Jaeger Benchmark heat transfer date for microstructured surfaces for immersion-cooled microelectronics IEEE Trans Compon Packag Technol 29 1 2006 89 97 (Pubitemid 43348937)
13. J.L. Parker, and M.S. El-Genk Enhanced saturation and subcooled boiling of FC-72 dielectric liquid Int J Heat Mass Transfer 48 18 2005 3736 3752 (Pubitemid 40882659)
14. C.K. Yu, D.C. Lu, and T.C. Cheng Pool boiling heat transfer on artificial micro-cavity surfaces in dielectric fluid FC-72 J Micromech Microeng 16 10 2006 2092 2099 (Pubitemid 44403659)
15. M. Arik, A. Bar-Cohen, and S.M. You Enhancement of pool boiling critical heat flux in dielectric liquids by microporous coatings Int J Heat Mass Transfer 50 5-6 2007 997 1009 (Pubitemid 46186324)
16. Kim JH, Kashinath MR, Kwark SM, You SM. Optimization of microporous structure in enhancing pool boiling heat transfer of saturated R-123, FC-72 and water. In: Proc ASME-JSME thermal engineering summer heat transfer conference. Paper no. HT2007-32399; 2007.
17. W. Nakayama, T. Daikoku, H. Kuwahara, and T. Nakajima Dynamic model of enhanced boiling heat transfer on porous surfaces. Part I: Experimental investigation J Heat Transfer 102 3 1980 445 450 (Pubitemid 11479563)
18. T.M. Anderson, and I. Mudawar Microelectronic cooling by enhanced pool boiling of a dielectric fluorocarbon liquid J Heat Transfer 111 3 1989 752 759
19. M. Misale, G. Guglielmini, M. Frogheri, and A.E. Bergles FC-72 pool boiling from finned surfaces placed in a narrow channel: preliminary results J Heat Mass Transfer 34 6 1999 449 452
20. K.N. Rainey, and S.M. You Pool boiling heat transfer from plain and microporous, square pin-finned surfaces in saturated FC-72 J Heat Transfer 122 3 2000 509 516
21. J.-Y. Jung, and H.-Y. Kwak Effect of surface condition on boiling heat transfer from silicon chip with submicron-scale roughness Int J Heat Mass Transfer 49 23-24 2006 4543 4551 (Pubitemid 44188679)
22. C. Ramaswamy, Y. Joshi, W. Nakayama, and W.B. Johnson Effects of varying geometrical parameters on boiling from microfabricated enhanced structures J Heat Transfer 125 1 2003 103 109 (Pubitemid 36615127)
23. M.S. El-Genk, and J.L. Parker Enhanced boiling of HFE-7100 dielectric liquid on porous graphite J Energy Convers Manage 46 15-16 2005 2455 2481 (Pubitemid 40583501)
24. J.J. Wei, and H. Honda Effects of fin geometry on boiling heat transfer from silicon chips with micro-pin-fins immersed in FC-72 Int J Heat Mass Transfer 46 21 2003 4059 4070 (Pubitemid 36941669)
25. Al-Hajri E, Ohadi M, Dessiatoun SV, Qi J. Thermal performance of micro-structured evaporation surfaces - application to cooling of high flux microelectronics. In: Proc ASME international mechanical engineering congress and exposition; 2005. p. 799-805.
26. K. Ferjančič, D. Rajšelj, and I. Golobič Enhanced pool boiling CHF in FC-72 from a modulated porous layer coating J Enhanc Heat Transfer 13 2 2006 175 184 (Pubitemid 44520256)
27. S. Launay, A.G. Fedorov, Y. Joshi, A. Cao, and P.M. Ajayan Hybrid micro-nano structured thermal interfaces for pool boiling heat transfer enhancement Microelectron J 37 11 2006 1158 1164 (Pubitemid 44692713)
28. C.K. Yu, and D.C. Lu Pool boiling heat transfer on horizontal rectangular fin array in saturated FC-72 Int J Heat Mass Transfer 50 17-18 2007 3624 3637 (Pubitemid 46659987)
29. S. Ujereh, T. Fisher, and I. Mudawar Effects of carbon nanotube arrays on nucleate pool boiling Int J Heat Mass Transfer 50 19-20 2007 4023 4038 (Pubitemid 46733951)
30. C-D. Ghiu, and Y.K. Joshi Boiling performance on single-layered enhanced structures J Heat Transfer 127 7 2005 675 683 (Pubitemid 41131965)
31. A.A. Watwe, A. Bar-Cohen, and A. McNiel Combined pressure and subcooling effects on pool boiling from a PPGA chip package J Electron Packag 119 2 1997 95 105 (Pubitemid 127447138)
32. J.Y. Chang, and S.M. You Boiling heat transfer phenomena from micro-porous and porous surfaces in saturated FC-72 Int J Heat Mass Transfer 40 18 1997 4437 4447
33. M.S. El-Genk, and H.H. Saber Composite spreader for cooling computer chip with non-uniform heat dissipation IEEE Trans Compon Packag Technol 31 1 2008 165 172 (Pubitemid 351447608)
34. H. Kubo, H. Takamatsu, and H. Honda Effects of size and number density of micro-reentrant cavities on boiling heat transfer from a silicon chip immersed in degassed and gas-dissolved FC-72 J Enhanc Heat Transfer 6 2-4 1999 151 160
35. K.N. Rainey, and S.M. You Effects of heater size and orientation on pool boiling heat transfer from microporous coated surfaces Int J Heat Mass Transfer 44 2001 2589 2599 (Pubitemid 32494848)
36. J.L. Parker, and M.S. El-Genk Effect of surface orientation on nucleate boiling of FC-72 on porous graphite J Heat Transfer 128 11 2006 1159 1175 (Pubitemid 46117415)
37. M.S. El-Genk, and J.L. Parker Nucleate boiling of FC-72 and HFE-7100 on porous graphite at different orientations and liquid subcooling J Energy Convers Manage 49 4 2008 733 750 (Pubitemid 351625377)
38. M.S. El-Genk, H.H. Saber, and J.L. Parker Efficient spreaders for cooling high performance computer chips J Appl Therm Eng 27 5-6 2007 1072 1088 (Pubitemid 44918432)
39. J.Y. Chang, and S.M. You Heater orientation effects on pool boiling of microporous enhanced surfaces in saturated FC-72 J Heat Transfer 118 1996 937 943 (Pubitemid 126586349)
40. K.N. Rainey, S.M. You, and S. Lee Effect of pressure, subcooling, and dissolved gas on pool boiling from microporous surfaces in FC-72 J Heat Transfer 125 2003 75 83 (Pubitemid 36615124)
41. S.J. Reed, and I. Mudawar Elimination of boiling incipience temperature drop in highly wetting fluids using spherical contact with a flat surface Int J Heat Mass Transfer 42 1997 2439 2454 (Pubitemid 29253081)
42. A.H. Howard, and I. Mudawar Orientation effects on pool boiling critical heat flux (CHF) and modeling of CHF for near-vertical surfaces Int J Heat Mass Transfer 42 1999 1665 1688 (Pubitemid 29216365)
43. Howard AH. Effects of orientation and downward-facing convex curvature on pool boiling critical heat flux. PhD dissertation, Purdue University, West Lafayette, IN; 1999.
44. A. Priarone Effect of surface orientation on nucleate boiling and critical heat flux of dielectric fluids Int J Therm Sci 44 2005 822 831 (Pubitemid 40701760)
45. H. Honda, H. Takamastu, and J.J. Wei Enhanced boiling of FC-72 on silicon chips with micro-pin-fins and submicron scale roughness J Heat Transfer 124 2002 383 390 (Pubitemid 34416304)
46. Arik MA, Bar-Cohen A. Ebullient cooling of integrated circuits by novec fluids. In: Proc Pacific rim intersociety, electronics packaging conference, Kauai, Hawaii; July 18-23, 2001.
47. S.J. Kline The purposes of uncertainty analysis Trans ASME J Fluids Eng 1985 [June issue]