Efficient spreaders for cooling high-power computer chips

Applied Thermal Engineering

Volumn 27, Issue 5-6, 2007, Pages 1072-1088

  El Genk, Mohamed S ^a   Saber, Hamed H ^a   Parker, Jack L ^a  

^a MSC01 1070   (United States)

Author keywords

Composite spreaders; Cooling high power computer chips; Nucleate boiling of dielectric liquids

Indexed keywords

COMPUTER APPLICATIONS; COOLING; ENERGY DISSIPATION; GRAPHITE; MICROPROCESSOR CHIPS; POROUS MATERIALS;

COMPOSITE SPREADERS; COOLING HIGH-POWER COMPUTER CHIPS; NUCLEATE BOILING OF DIELECTRIC LIQUIDS; POROUS GRAPHITE;

SPREADERS;

EID: 33845474282     PISSN: 13594311     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.applthermaleng.2006.07.039     Document Type: Article

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