Effects of size and number density of micro-reentrant cavities on boiling heat transfer from a silicon chip immersed in degassed and gas-dissolved FC-72

Journal of Enhanced Heat Transfer

Volumn 6, Issue 2, 1999, Pages 151-160

  Kubo, H ^a   Takamatsu, H ^a   Honda, H ^a  

^a KYUSHU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BOILING LIQUIDS; COOLING; DEGASSING; FLUOROCARBONS; MICROPROCESSOR CHIPS; SILICON ON INSULATOR TECHNOLOGY; SURFACE STRUCTURE; SURFACE TREATMENT;

IMMERSION COOLING; MICRO-REENTRANT CAVITY; NUMBER DENSITY; SILICON CHIP;

HEAT TRANSFER;

EID: 0032623814     PISSN: 10655131     EISSN: None     Source Type: Journal    
DOI: 10.1615/JEnhHeatTransf.v6.i2-4.80     Document Type: Article

References (3)

1. Anderson, T. M. and Mudawar, I. (1989) Microelectronic Cooling by Enhanced Pool Boiling of a Dielectric Fluorocarbon Liquid, Journal of Heat Transfer, 111, 752-759.
2. Carvalho, R. D. and Bergles, A. E. (1990) The Influence of Subcooling on the Pool Nucleate Boiling and Critical Heat Flux of Simulated Electronic Chips, Proc. 9th Int. Heat Transfer Conf., 2, 289-294.
3. Chu, R. C. and Moran, K. P. (1977) Method for Customizing Nucleate Boiling Heat Transfer from Electronic Units Immersed in Dielectric Coolant, U. S. Patent No. 4, 650, 507.