-
2
-
-
0037002435
-
Thermal challenges in next generation electronic systems summary of panel presentations and discussions
-
S.V. Garimella, Y.K. Joshi, A. Bar-Cohen, R. Mahajan, K.C. Toh, and V.P. Baelmans Thermal challenges in next generation electronic systems summary of panel presentations and discussions IEEE Trans Comp Packing Technol 25 4 2002 569 575
-
(2002)
IEEE Trans Comp Packing Technol
, vol.25
, Issue.4
, pp. 569-575
-
-
Garimella, S.V.1
Joshi, Y.K.2
Bar-Cohen, A.3
Mahajan, R.4
Toh, K.C.5
Baelmans, V.P.6
-
4
-
-
0037481243
-
An advanced multichip module (MCM) for high-performance UNIX servers
-
J.U. Knickerbocker An advanced multichip module (MCM) for high-performance UNIX servers IBM J Res Dev 46 6 2002 779 804
-
(2002)
IBM J Res Dev
, vol.46
, Issue.6
, pp. 779-804
-
-
Knickerbocker, J.U.1
-
6
-
-
0034251955
-
Pool boiling heat transfer from plain and microporous, square pin-finned surfaces in saturated FC-72
-
K.N. Rainey, and S.M. You Pool boiling heat transfer from plain and microporous, square pin-finned surfaces in saturated FC-72 ASME J Heat Transfer 122 2000 509 516
-
(2000)
ASME J Heat Transfer
, vol.122
, pp. 509-516
-
-
Rainey, K.N.1
You, S.M.2
-
8
-
-
1242264370
-
The effect of nozzle configuration and coolant flow rate on spray evaporative cooling in multi-chip module using FC-72
-
Pautsch G, Shedd TA. The effect of nozzle configuration and coolant flow rate on spray evaporative cooling in multi-chip module using FC-72. In: Proceedings of ASME IPACK03, vol. 2, 2003. p. 455-66
-
(2003)
Proceedings of ASME IPACK03
, vol.2
, pp. 455-466
-
-
Pautsch, G.1
Shedd, T.A.2
-
9
-
-
0347365828
-
Experimental investigations of spray/wall impingement
-
W.S. Mathews, C.F. Lee, and J.E. Peters Experimental investigations of spray/wall impingement Atom Sprays 13 2,3 2003 223 242
-
(2003)
Atom Sprays
, vol.13
, Issue.23
, pp. 223-242
-
-
Mathews, W.S.1
Lee, C.F.2
Peters, J.E.3
-
11
-
-
17844389265
-
Boiling heat transfer enhancement by submerged, vibration induced jets
-
Tillery SW, Heffington S, Smith MK, Glezer A. Boiling heat transfer enhancement by submerged, vibration induced jets. In: Proceedings 9th intersociety conference on thermal phenomena (Itherm-04), vol. 1, 2004. p. 655-62
-
(2004)
Proceedings 9th Intersociety Conference on Thermal Phenomena (Itherm-04)
, vol.1
, pp. 655-662
-
-
Tillery, S.W.1
Heffington, S.2
Smith, M.K.3
Glezer, A.4
-
12
-
-
4444325347
-
Miniature loop heat pipes a promising means for cooling electronics
-
Maydanik YF, Vershinin SV, Korukov MA, Octerbeck JM. Miniature loop heat pipes a promising means for cooling electronics. In: Proceedings 9th intersociety conference on thermal phenomena (Itherm-04), vol. 2, 2004. p. 60-6
-
(2004)
Proceedings 9th Intersociety Conference on Thermal Phenomena (Itherm-04)
, vol.2
, pp. 60-66
-
-
Maydanik, Y.F.1
Vershinin, S.V.2
Korukov, M.A.3
Octerbeck, J.M.4
-
13
-
-
4444278709
-
Direct liquid cooling of a stacked MCM
-
Chen XY, Toh KC, Wong TN, Chai JC, Pinjala D, Navas OK, et al. Direct liquid cooling of a stacked MCM. In: Proceedings 9th intersociety conference on thermal phenomena (Itherm-04), vol. 1, 2004. p. 199-206
-
(2004)
Proceedings 9th Intersociety Conference on Thermal Phenomena (Itherm-04)
, vol.1
, pp. 199-206
-
-
Chen, X.Y.1
Toh, K.C.2
Wong, T.N.3
Chai, J.C.4
Pinjala, D.5
Navas, O.K.6
-
14
-
-
0043125612
-
The relation between bubble frequency and diameter during nucleate pool boiling
-
P.W. McFadden, and P. Grassmann The relation between bubble frequency and diameter during nucleate pool boiling Int J Heat Mass Transfer 5 1961 169 173
-
(1961)
Int J Heat Mass Transfer
, vol.5
, pp. 169-173
-
-
McFadden, P.W.1
Grassmann, P.2
-
15
-
-
0000488479
-
Relationships between bubble frequency, departure diameter and rise velocity in nuclear boiling
-
H.J. Ivey Relationships between bubble frequency, departure diameter and rise velocity in nuclear boiling Int J Heat Mass Transfer 10 1967 1023 1040
-
(1967)
Int J Heat Mass Transfer
, vol.10
, pp. 1023-1040
-
-
Ivey, H.J.1
-
16
-
-
0037408758
-
Saturation boiling of HFE-7100 from a copper surface, simulating a microelectronic chip
-
M.S. El-Genk, and H. Bostanci Saturation boiling of HFE-7100 from a copper surface, simulating a microelectronic chip Int J Heat Mass Transfer 46 2003 1841 1854
-
(2003)
Int J Heat Mass Transfer
, vol.46
, pp. 1841-1854
-
-
El-Genk, M.S.1
Bostanci, H.2
-
17
-
-
0242411634
-
Combined effects of subcooling and surface orientation on pool boiling of HFE-7100 from a simulated electronic chip
-
M.S. El-Genk, and H. Bostanci Combined effects of subcooling and surface orientation on pool boiling of HFE-7100 from a simulated electronic chip Exp Heat Transfer 16 2003 281 301
-
(2003)
Exp Heat Transfer
, vol.16
, pp. 281-301
-
-
El-Genk, M.S.1
Bostanci, H.2
-
18
-
-
84984086937
-
The effects of superheat and surface roughness on boiling coefficients
-
H.M. Kurihara, and J.E. Myers The effects of superheat and surface roughness on boiling coefficients Am Inst Chem Engrs J 6 1960 83 91
-
(1960)
Am Inst Chem Engrs J
, vol.6
, pp. 83-91
-
-
Kurihara, H.M.1
Myers, J.E.2
-
23
-
-
0001899168
-
Influences of porous coating on the boiling burnout heat flux
-
Sunden B et al., editors
-
Tehver J. Influences of porous coating on the boiling burnout heat flux. In: Sunden B et al., editors. Recent Advances in Heat Transfer, 1992. p. 231-42
-
(1992)
Recent Advances in Heat Transfer
, pp. 231-242
-
-
Tehver, J.1
-
24
-
-
0029108439
-
A painting technique to enhance pool boiling heat transfer in FC-72
-
J.P. O'Connor, and S.M. You A painting technique to enhance pool boiling heat transfer in FC-72 ASME J Heat Transfer 117 1995 387 393
-
(1995)
ASME J Heat Transfer
, vol.117
, pp. 387-393
-
-
O'Connor, J.P.1
You, S.M.2
-
25
-
-
0000013494
-
Heater orientation effects on pool boiling of microporous enhanced surfaces in saturated FC-72
-
J.Y. Chang, and S.M. You Heater orientation effects on pool boiling of microporous enhanced surfaces in saturated FC-72 ASME J Heat Transfer 118 1996 937 943
-
(1996)
ASME J Heat Transfer
, vol.118
, pp. 937-943
-
-
Chang, J.Y.1
You, S.M.2
-
26
-
-
0002427052
-
Enhanced boiling heat transfer from microporous cylindrical surfaces in saturated FC-87 and R-123
-
J.Y. Chang, and S.M. You Enhanced boiling heat transfer from microporous cylindrical surfaces in saturated FC-87 and R-123 ASME J Heat Transfer 119 May 1997 319 325
-
(1997)
ASME J Heat Transfer
, vol.119
, pp. 319-325
-
-
Chang, J.Y.1
You, S.M.2
-
27
-
-
0036602685
-
Mechanism of nucleate boiling heat transfer enhancement from microporous surfaces in saturated FC-72
-
J.H. Kim, N. Rainey, S.M. You, and J.Y. Pak Mechanism of nucleate boiling heat transfer enhancement from microporous surfaces in saturated FC-72 ASME J Heat Transfer 124 3 2002 500 506
-
(2002)
ASME J Heat Transfer
, vol.124
, Issue.3
, pp. 500-506
-
-
Kim, J.H.1
Rainey, N.2
You, S.M.3
Pak, J.Y.4
-
30
-
-
4444228881
-
Using segregated HFE's as heat transfer fluids: Avoiding problems in system design
-
P.E. Tuma Using segregated HFE's as heat transfer fluids: avoiding problems in system design Chem Process 64 Feb. 2001 47 50
-
(2001)
Chem Process
, vol.64
, pp. 47-50
-
-
Tuma, P.E.1
-
31
-
-
0023206148
-
Saturated pool boiling characteristics of commercially available perfluorinated inert liquids
-
R. Danielson, L. Tousignant, and A. Bar-Cohen Saturated pool boiling characteristics of commercially available perfluorinated inert liquids Proc ASME/JSME Thermal Eng Joint Conf 3 1987 419 430
-
(1987)
Proc ASME/JSME Thermal Eng Joint Conf
, vol.3
, pp. 419-430
-
-
Danielson, R.1
Tousignant, L.2
Bar-Cohen, A.3
-
34
-
-
0020129274
-
Pool boiling heat transfer from enhanced surfaces to dielectric fluids
-
P.J. Marto, and V.J. Lepere Pool boiling heat transfer from enhanced surfaces to dielectric fluids ASME J Heat Transfer 104 May 1982 292 303
-
(1982)
ASME J Heat Transfer
, vol.104
, pp. 292-303
-
-
Marto, P.J.1
Lepere, V.J.2
-
35
-
-
1242287011
-
Benchmark heat transfer data for a micro-structured surface for immersion cooled microelectronics
-
Nimkar ND, Bhavnani SH, Jaeger RC. Benchmark heat transfer data for a micro-structured surface for immersion cooled microelectronics. In: Proceedings of ASME InterPACK'03, vol. 2, 2003. p. 575-85
-
(2003)
Proceedings of ASME InterPACK'03
, vol.2
, pp. 575-585
-
-
Nimkar, N.D.1
Bhavnani, S.H.2
Jaeger, R.C.3
-
36
-
-
0141795653
-
Effect of pressure, subcooling and dissolved gas on pool boiling heat transfer from microporous, square pin-finned surfaces in FC-72
-
K.N. Rainey, S.M. You, and S. Lee Effect of pressure, subcooling and dissolved gas on pool boiling heat transfer from microporous, square pin-finned surfaces in FC-72 Int J Heat Mass Transfer 46 2003 23 35
-
(2003)
Int J Heat Mass Transfer
, vol.46
, pp. 23-35
-
-
Rainey, K.N.1
You, S.M.2
Lee, S.3
-
37
-
-
0038239861
-
Effect of pressure, subcooling and dissolved gas on pool boiling from microporous surfaces in FC-72
-
K.N. Rainey, S.M. You, and S. Lee Effect of pressure, subcooling and dissolved gas on pool boiling from microporous surfaces in FC-72 ASME J Heat Transfer 125 2003 75 83
-
(2003)
ASME J Heat Transfer
, vol.125
, pp. 75-83
-
-
Rainey, K.N.1
You, S.M.2
Lee, S.3
-
38
-
-
0031620348
-
Towards optimizing enhanced surfaces for passive immersion cooled heat sinks
-
Seattle, WA, 27-30 May
-
Baldwin CS, Bhavnani SH, Jaeger RC. Towards optimizing enhanced surfaces for passive immersion cooled heat sinks. In: ITHERM'98 Proceedings of the intersociety conference on thermal and thermotechnical phenomena in electronic systems, Seattle, WA, 27-30 May 1998. p. 399-407
-
(1998)
ITHERM'98 Proceedings of the Intersociety Conference on Thermal and Thermotechnical Phenomena in Electronic Systems
, pp. 399-407
-
-
Baldwin, C.S.1
Bhavnani, S.H.2
Jaeger, R.C.3
-
39
-
-
0035218069
-
Boiling of methanol and HFE-7100 on heated surface covered with a layer of mesh
-
J.W. Liu, D.J. Lee, and A. Su Boiling of methanol and HFE-7100 on heated surface covered with a layer of mesh Int J Heat Mass Transfer 44 2001 241 246
-
(2001)
Int J Heat Mass Transfer
, vol.44
, pp. 241-246
-
-
Liu, J.W.1
Lee, D.J.2
Su, A.3
-
40
-
-
0032623814
-
Effects of size and number density of micro-re-entrant cavities on boiling heat transfer from a silicon chip immersed in degassed and gas dissolved FC-72
-
H. Kubo, H. Takamatsu, and H. Honda Effects of size and number density of micro-re-entrant cavities on boiling heat transfer from a silicon chip immersed in degassed and gas dissolved FC-72 Enhanced Heat Transfer 6 2-4 1999 151 160
-
(1999)
Enhanced Heat Transfer
, vol.6
, Issue.2-4
, pp. 151-160
-
-
Kubo, H.1
Takamatsu, H.2
Honda, H.3
-
42
-
-
0036536682
-
Enhanced boiling of FC-72 on silicon chips with micro-pin fins and submicron scale roughness
-
H. Honda, H. Takamastu, and J.J. Wei Enhanced boiling of FC-72 on silicon chips with micro-pin fins and submicron scale roughness ASME J Heat Transfer 124 2002 383 390
-
(2002)
ASME J Heat Transfer
, vol.124
, pp. 383-390
-
-
Honda, H.1
Takamastu, H.2
Wei, J.J.3
-
44
-
-
0031168913
-
Combined pressure and subcooling effects on pool boiling from a PPGA chip package
-
A.A. Watwe, A. Bar-Cohen, and A. McNeil Combined pressure and subcooling effects on pool boiling from a PPGA chip package J Electron Packaging 119 1997 95 105
-
(1997)
J Electron Packaging
, vol.119
, pp. 95-105
-
-
Watwe, A.A.1
Bar-Cohen, A.2
McNeil, A.3
-
45
-
-
0346039054
-
Advances in enhanced boiling heat transfer from electronic components
-
H. Honda, and J.J. Wei Advances in enhanced boiling heat transfer from electronic components JSME Int J, Ser B: Fluids Thermal Eng 46 2003 479 490
-
(2003)
JSME Int J, Ser B: Fluids Thermal Eng
, vol.46
, pp. 479-490
-
-
Honda, H.1
Wei, J.J.2
-
48
-
-
0003443414
-
-
Report AEEW-R137, United Kingdom Atomic Energy Authority, Winfrith, England
-
Ivey HJ, Morris DJ. On the relevance of the vapor-liquid exchange mechanisms for subcooled boiling heat transfer at high pressure. Report AEEW-R137, United Kingdom Atomic Energy Authority, Winfrith, England, 1962
-
(1962)
On the Relevance of the Vapor-liquid Exchange Mechanisms for Subcooled Boiling Heat Transfer at High Pressure
-
-
Ivey, H.J.1
Morris, D.J.2
-
49
-
-
0009090429
-
Boiling heat transfer of silicon integrated circuits chip mounted on a substrate
-
U.P. Hwang, and K.P. Moran Boiling heat transfer of silicon integrated circuits chip mounted on a substrate Heat Transfer Electron Equip, ASME HTD 20 1981 53 59
-
(1981)
Heat Transfer Electron Equip, ASME HTD
, vol.20
, pp. 53-59
-
-
Hwang, U.P.1
Moran, K.P.2
-
50
-
-
0024937966
-
High flux electronic cooling by means of pool boiling - Part I: Parametric investigation of the effects of coolant variation pressurization, subcooling and surface augmentation, heat transfer in electronics
-
ASME HTD
-
Mudawar I, Anderson TM. High flux electronic cooling by means of pool boiling - Part I: Parametric investigation of the effects of coolant variation pressurization, subcooling and surface augmentation, heat transfer in electronics. In: 26th national heat transfer conference, ASME HTD, vol. 111, 1989. p. 25-34
-
(1989)
26th National Heat Transfer Conference
, vol.111
, pp. 25-34
-
-
Mudawar, I.1
Anderson, T.M.2
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