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Volumn 42, Issue 13, 1999, Pages 2439-2454

Elimination of boiling incipience temperature drop in highly wetting fluids using spherical contact with a flat surface

Author keywords

[No Author keywords available]

Indexed keywords

HEAT FLUX; SURFACE ROUGHNESS; WETTING;

EID: 0345104267     PISSN: 00179310     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0017-9310(98)00331-7     Document Type: Article
Times cited : (28)

References (12)
  • 2
    • 0024716535 scopus 로고
    • Microelectronic cooling by enhance pool boiling of a dielectric fluorocarbon liquid
    • T.M. Anderson, I. Mudawar, Microelectronic cooling by enhance pool boiling of a dielectric fluorocarbon liquid, ASME J. Heat Transfer 111 (1989) 752-759.
    • (1989) ASME J. Heat Transfer , vol.111 , pp. 752-759
    • Anderson, T.M.1    Mudawar, I.2
  • 3
    • 0025538460 scopus 로고
    • Boiling incipience and nucleate boiling heat transfer of highly wetting dielectric fluids from electronic materials
    • S.M. You, A. Bar-Cohen, T.W. Simon, Boiling incipience and nucleate boiling heat transfer of highly wetting dielectric fluids from electronic materials, IEEE Trans. on Components, Hybrids, and Mfg. Tech. 13 (1990) 1032-1039.
    • (1990) IEEE Trans. on Components, Hybrids, and Mfg. Tech. , vol.13 , pp. 1032-1039
    • You, S.M.1    Bar-Cohen, A.2    Simon, T.W.3
  • 4
    • 0344153247 scopus 로고
    • D6-24576, Boeing Co., Commercial Airplane Division, Renton, WA, May AD-705974, National Technical Information Service, Springfield, VA
    • J.W. Thornell, W.A. Fahley, W.L. Alexander, Hybrid Microcircuit Design and Procurement Guide, D6-24576, Boeing Co., Commercial Airplane Division, Renton, WA, May 1970. AD-705974, National Technical Information Service, Springfield, VA.
    • (1970) Hybrid Microcircuit Design and Procurement Guide
    • Thornell, J.W.1    Fahley, W.A.2    Alexander, W.L.3
  • 6
    • 0344153245 scopus 로고    scopus 로고
    • Heat transfer in pool boiling, U.S. Patent 4,074,753. 21 February 1978
    • K. Schmittle, K.E. Starner, Heat transfer in pool boiling, U.S. Patent 4,074,753. 21 February 1978.
    • Schmittle, K.1    Starner, K.E.2
  • 7
    • 0024925941 scopus 로고
    • Effects of cylindrical wall attachment on nucleate boiling
    • M.C. Chyu, A.M. Mghamis, Effects of cylindrical wall attachment on nucleate boiling, ASME HTD 114 (1989) 69-74.
    • (1989) ASME HTD , vol.114 , pp. 69-74
    • Chyu, M.C.1    Mghamis, A.M.2
  • 8
    • 0031175974 scopus 로고    scopus 로고
    • Enhancement of boiling heat transfer using highly wetting liquids with pressed-on fins at low contact forces
    • S.J. Reed, I. Mudawar, Enhancement of boiling heat transfer using highly wetting liquids with pressed-on fins at low contact forces, Int. J. Heat Mass Transfer 40 (1997) 2379-2392.
    • (1997) Int. J. Heat Mass Transfer , vol.40 , pp. 2379-2392
    • Reed, S.J.1    Mudawar, I.2
  • 9
    • 0015125402 scopus 로고
    • Heat transfer from multiple spines to boiling liquids
    • G.J. Klein, J.W. Westwater, Heat transfer from multiple spines to boiling liquids, AIChE J. 17 (1971) 1050-1056.
    • (1971) AIChE J. , vol.17 , pp. 1050-1056
    • Klein, G.J.1    Westwater, J.W.2
  • 11
    • 0003608651 scopus 로고
    • Wiley, New York
    • M. Jakob, Heat Transfer, Wiley, New York, 1949, p. 636.
    • (1949) Heat Transfer , pp. 636
    • Jakob, M.1
  • 12
    • 0026887482 scopus 로고
    • Dual-tapered-piston (DTP) module cooling for IBM Enterprise System/9000 systems
    • G.F. Goth, M.L. Zumbrunnen, K.P. Moran, Dual-tapered-piston (DTP) module cooling for IBM Enterprise System/9000 systems, IBM J. Res. Develop. 36 (1992) 805-816.
    • (1992) IBM J. Res. Develop. , vol.36 , pp. 805-816
    • Goth, G.F.1    Zumbrunnen, M.L.2    Moran, K.P.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.