Effect of surface orientation on nucleate boiling of FC-72 on porous graphite

Journal of Heat Transfer

Volumn 128, Issue 11, 2006, Pages 1159-1175

  Parker, Jack L ^a   El Genk, Mohamed S ^a,b,c  

^a MSC01 1070   (United States)

^b Department of Chemical and Nuclear Engineering ^*  (United States)

^c Institute for Space and Nuclear Power Studies   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRITICAL HEAT FLUX; POROUS GRAPHITE; SURFACE ORIENTATION;

COOLING; COPPER; DIELECTRIC LIQUIDS; GRAPHITE; HEAT FLUX; HEAT TRANSFER; SATURATION (MATERIALS COMPOSITION);

NUCLEATE BOILING;

COOLING; COPPER; DIELECTRIC LIQUIDS; GRAPHITE; HEAT FLUX; HEAT TRANSFER; NUCLEATE BOILING; SATURATION (MATERIALS COMPOSITION);

EID: 33846311072     PISSN: 00221481     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.2352783     Document Type: Article

References (45)

1. Knickerbocker, J. U., et al., 2002, "An Advanced Multichip Module (MCM) for High-Performance UNIX Servers," IBM J. Res. Dev., 46(6), pp. 779-804.
2. ITRS, International Technology Roadmap for Semiconductors, 2004.
3. Rainey, K. N., and You, S. M., 2000, "Pool Boiling Heat Transfer from Plain and Microporous, Square Pin-Finned Surfaces in Saturated FC-72," J. Heat Transfer, 122, pp. 509-516.
4. Rainey, K. N., You, S. M., and Lee, S., 2003, "Effect of Pressure, Subcooling, and Dissolved Gas on Pool Boiling from Microporous Surfaces in FC-72," J. Heat Transfer, 125, pp. 75-83.
5. El-Genk, M. S., and Bostanci, H., 2003a, "Saturation Boiling of HFE-7100 from a Copper Surface, Simulating a Microelectronic Chip," Int. J. Heat Mass Transfer, 46, pp. 1841-1854.
6. El-Genk, M. S., and Bostanci, H., 2003b, "Combined Effects of Subcooling and Surface Orientation on Pool Boiling of HFE-7100 from a Simulated Electronic Chip," Exp. Heat Transfer, 16, pp. 281-301.
7. Chen, X. Y., Toh, K. C., Wong, T. N., Chai, J. C., Pinjala, D., Navas, O. K., Ganesh, H. Z., and Kripesh, V., 2004, "Direct Liquid Cooling of a Stacked MCM," Proceedings 9th Intersociety Conference on Thermal Phenomena, Las Vegas, NV, June 1-4, IEEE, Piscataway, NJ, Vol. 1, pp. 199-206.
8. Ravigururajan, T. S., and Drost, M. K., 1999, "Single-Phase Flow Thermal Performance Characteristics of a Parallel Microchannel Heat Exchanger," J. Enhanced Heat Transfer, 6, pp. 383-393.
9. Mathews, W. S., Lee, C. F., and Peters, J. E., 2003, "Experimental Investigations of Spray/Wall Impingement," Atomization Sprays, 13(2,3), pp. 223-242.
10. Pautsch, G., and Shedd, T. A., 2005, "Spray and Impingement Cooling with Single- and Multiple-Nozzle Arrays. Part I: Heat Transfer Data Using FC-72," Int. J. Heat Mass Transfer, 48, pp. 3167-3175.
11. Chang, J. Y., and You, S. M., 1996, "Heater Orientation Effects on Pool Boiling of Microporous Enhanced Surfaces in Saturated FC-72," J. Heat Transfer, 118, pp. 937-943.
12. Chang, J. Y., and You, S. M., 1997a, "Boiling Heat Transfer Phenomena from Micro-porous and Porous Surfaces in Saturated FC-72," Int. J. Heat Mass Transfer, 40, pp. 4437-4447.
13. Chang, J. Y., and You, S. M., 1997b, "Enhanced Boiling Heat Transfer from Micro-porous Surfaces: Effects of a Coating Composition and Method," Int. J. Heat Mass Transfer, 40, pp. 4449-4460.
14. Arik, M., and Bar-Cohen, A., 2001, "Ebullient Cooling of Integrated Circuits by Novec Fluids," Adv. Electron. Circuit Packag., 2, pp. 627-637.
15. Honda, H., and Wei, J. J., 2003, "Advances in Enhanced Boiling Heat Transfer From Electronic Components," JSME Int. J., Ser. B, 46, pp. 479-490.
16. Wei, J. J., and Honda, H., 2004, "Enhanced Boiling Heat Transfer From Electronic Components by Use of Surface Microstructures," Exp. Therm. Fluid Sci., 28, pp. 159-169.
17. El-Genk, M. S., and Parker, J. L., 2005, "Enhanced Boiling of HFE-7100 Dielectric Liquid on a Porous Graphite Surface," Energy Convers. Manage., 46, pp. 2455-2481.
18. Parker, J. L., and El-Genk, M. S., 2005, "Enhanced Saturation and Subcooled Boiling of FC-72 Dielectric Liquid," Int. J. Heat Mass Transfer, 48, pp. 3736-3752.
19. Priarone, A., 2005, "Efect of Surface Orientation on Nucleate Boiling and Critical heat Flux of Dielectric Fluids," Int. J. Therm. Sci., 44, pp. 822-831.
20. El-Genk, M. S., Saber, H. H., and Parker, J. L., 2005, "Thermal Analyses of Composite Copper/Porous Graphite Spreaders for Immersion Cooling Applications," Proceedings of Conference on Integration and Packaging of MEMS, NEMS, and Electronics (InterPack'05), Paper No. IPACK2005-73226, San Francisco, CA, July 17-22, ASME, New York.
21. Klett, J. W., and Trammell, M., 2004, "Parametric Investigation of a Graphite Foam Evaporator in a Thermosyphon With Fluorinert and a Silicon CMOS Chip," IEEE Trans. Device Mater. Reliab., 4, pp. 626-637.
22. Coursey, J. S., Kim, J., and Boudreaux, P. J., 2005, "Performance of Graphite Foam Evaporator for Use the Thermal Management," J. Electron. Packag., 127, pp. 127-134.
23. El-Genk, M. S., and Parker, J. L., 2004a, "Pool Boiling in Saturated and Subcooled HFE-7100 Dielectric Fluid From a Porous Graphite Surface," Proceedings 9th Intersociety Conference on Thermal Phenomena, Las Vegas, NV, June 1-4, IEEE, Piscataway, NJ, Vol. 1, pp. 655-662.
24. El-Genk, M. S., and Parker, J. L., 2004b, "Pool Boiling in Saturated and Subcooled FC-72 Dielectric Fluid from a Porous Graphite Surface," Proceedings, ASME International Mechanical Engineering Congress, Paper No. IMECE2004-59905, Anaheim, CA, November 13-19, ASME, New York.
25. Honda, H., Takamastu, H., and Wei, J. J., 2002, "Enhanced Boiling of FC-72 on Silicon Chips With Micro-Pin-Fins and Submicron Scale Roughness," J. Heat Transfer, 124, pp. 383-390.
26. Howard, A. H., and Mudawar, L, 1999, "Orientation Effects on Pool Boiling Critical Heat Flux (CHF) and Modeling of CHF for Near-Vertical Surfaces," Int. J. Heat Mass Transfer, 42, pp. 1665-1688.
27. Mudawar, I., Howard, A. H., and Gersey, C. O., 1999, "An Analytical Model for Near Saturated Pool Boiling Critical Heat Flux on Verticad Surfaces," Int. J. Heat Mass Transfer, 40, pp. 2327-2339.
28. Rainey, K. N., and You, S. M., 2001, "Effects of Heater Size and Orientation on Pool Boiling Heat Transfer from Microporous Coated Surfaces," Int. J. Heat Mass Transfer, 44, pp. 2589-2599.
29. Reed, S. J., and Mudawar, L, 1997, "Elimination of Boiling Incipience Temperature Drop in Highly Wetting Fluids using Spherical Contact With a Flat Surface," Int. J. Heat Mass Transfer, 42, pp. 2439-2454.
30. Beduz, C., Scurlock, R. G., and Sousa, A. J., 1988, "Angular Dependence on Boiling Heat Transfer Mechanisms in Liquid Nitrogen," Advances in Cryogenic Engineering, R. Fast, ed., Vol. 33, Plenum Press, New York, pp. 363-370.
31. El-Genk, M. S., and Guo, Z., 1993, "Transient Boiling From Inclined and Downward-facing Surfaces in a Saturated Pool," Int. J. Refrig., 16, pp. 414-422.
32. Nishikawa, K., Fujita, Y., Uchida, S., and Ohta, H., 1984, "Effect of Surface Configuration on Nucleate Boiling Heat Transfer," Int. J. Heat Mass Transfer, 27, pp. 1559-1571.
33. Vishnev, I. P., Filatov, I. A., Vinokur, Ya. G., Gorokhov, V. V., and Svalov, G. G., 1976, "Study of Heat Transfer in Boiling of Helium on Surfaces with Various Orientations," Heat Transfer-Sov. Res., 8, pp. 104-108.
34. Wei, J. J., and Honda, H., 2003, "Effects of Fin Geometry on Boiling Heat Transfer from Silicon Chips with Micro-Pin-Fins Immersed in FC-72," Int. J. Heat Mass Transfer, 46, pp. 4059-4070.
35. You, S. M., Simon, T. W., and Bar-Cohen, A., 1992, "A Technique for Enhancing Boiling Heat Transfer with Application to Cooling of Electronic Equipment," IEEE Trans. Compon., Hybrids, Manuf. Technol., 15, pp. 823-831.
36. CRC Handbook of Chemistry and Physics, 66th ed., 1986, R. C. Wheast, ed., CRC Press, Boca Raton, FL.
37. Poco Graphite Inc., 2005, Poco HTC Product Information.
38. Chang, J. Y., 1997, "Enhanced Boiling Heat Transfer from Micro-Porous Surfaces," Ph.D. dissertation, University of Texas at Arlington, TX.
39. Kutateladze, S. S., 1961, "Boiling Heat Transfer," Int. J. Heat Mass Transfer, 4, pp. 31-45.
40. McNiel, A. C., 1992, "Pool Boiling Critical Heat Flux in a Highly Wetting Liquid," Masters thesis, University of Minnesota, Minneapolis, MN.
41. O'Connor, J. P., 1994, "Enhancement of Pool Boiling Heat Transfer in Highly Wetting Dielectric Liquids," Ph.D. dissertation, University of Texas at Arlington, TX.
42. Liu, Z. W., Lin, W. W., Lee, D. J., and Peng, X. F., 2001, "Pool Boiling of FC-72 and HFE-7100," J. Heat Transfer, 123, pp. 399-400.
43. Rainey, K. N., 2001, "Pool and Flow Boiling Heat Transfer from Microporous Flat and Finned Surfaces in FC-72," Ph.D. dissertation, University of Texas at Arlington, TX.
44. Reed, S. J., 1996, "Elimination of Boiling Incipience Temperature Drop and Enhancement of Boiling Heat Transfer in Highly Wetting Fluids Through Low Contact Force Attachments," Master's thesis, Purdue University, West Lafayette, IN.
45. Howard, A. H., 1999, "Effects on Orientation and Downward-Facing Convex Curvature on Pool Boiling Critical Heat Flux," Ph.D. dissertation, Purdue University, West Lafayette, IN.