Numerical simulation of hot embossing filling stage using a viscoelastic constitutive model

Korea Australia Rheology Journal

Volumn 23, Issue 3, 2011, Pages 139-146

  Park, Jang Min ^a   Kang, Tae Gon ^b   Park, Seong Jin ^a  

^a Pohang University of Science and Technology (POSTECH)   (South Korea)

^b Hankuk Aviation University   (South Korea)

Author keywords

Finite element method; Hot embossing; Squeezing flow; Viscoelasticity

Indexed keywords

EID: 80053343532     PISSN: 1226119X     EISSN: 20937660     Source Type: Journal    
DOI: 10.1007/s13367-011-0017-3     Document Type: Article

References (21)

1. Arora, A., G. Simone, G. B. Salieb-Beugelaar, J. T. Kim, and A. Manz, 2010, Latest developments in micro total analysis systems, Anal. Chem. 82, 4830-4847.
2. Becker, H. and U. Heim, 2000, Hot embossing as a method for the fabrication of polymer high aspect ratio structures, Sensors and Actuators 83, 130-135.
3. Fattal, R. and R. Kupferman, 2004, Constitutive laws for the matrix-logarithm of the conformation tensor, J. Non-Newtonian Fluid Mech. 123, 281-285.
4. Fortin, M. and A. Fortin, 1989, A new approach for the FEM simulation of viscoelastic flows, J. Non-Newtonian Fluid Mech. 32, 295-310.
5. Guénette, R. and M. Fortin, 1995, A new mixed finite element method for computing viscoelastic flows, J. Non-Newtonian Fluid Mech. 60, 27-52.
6. Haagh, G. A. A. V. and F. N. van De Vosse, 1998, Simulation of three-dimensional polymer mould filling processes using a pseudo-concentration method, Int. J. Numer. Meth. Fluids 28, 1355-1369.
7. He, Y., J. Z. Fu and Z. C. Chen, 2007, Research on optimization of the hot embossing process, J. Micromech. Microeng. 17, 2420-2425.
8. Heckele, M., W. Bacher, and K. D. Müller, 1998, Hot embossing - The molding technique for plastic microstructures, Microsyst. Technol. 4, 122-124.
9. Heckele, M. and W. K. Schomburg, 2004, Review on micro molding of thermoplastic polymers, J. Micromech. Microeng. 14, R1-R14
10. Hirt, C. W., A. A. Amsden, and J. L. Cook, 1997, An arbitrary lagrangian-eulerian computing method for all flow speeds, J. Comput. Phys. 135, 203-216.
11. HSL, 2011, A collection of Fortran codes for large scale scientific computation. http://www.hsl.rl.ac.uk.
12. Hulsen, M. A., R. Fattal, and R. Kupferman, 2005, Flow of viscoelastic fluids past a cylinder at high Weissenberg number: Stabilized simulations using matrix logarithms, J. Non-Newtonian Fluid Mech. 127, 27-39.
13. Juang, Y. J., J. Lee, and K. W. Koelling, 2002, Hot embossing in microfabrication. Part II: Rheological characterization and process analysis, Polym. Eng. Sci. 42, 551-566.
14. Kang, T. G. and T. H. Kwon, 2007, Numerical investigation of hot embossing filling characteristics, Int. Polym. Process. 22, 266-275.
15. Park, J. M., N. H. Kim, B.-K. Lee, K.-H. Lee, and T. H. Kwon, 2008, Nickel stamp fabrication and hot embossing for massproduction of micro/nano combined structures using anodic aluminum oxide, Microsyst. Technol. 14, 1689-1694.
16. Press, W. H., S. A. Teukolsky, W. T. Vetterling, and B. P. Flannery, 1992, Numerical recipes in FORTRAN 77: the art of scientific computing, Cambridge University Press.
17. Sussman, M., P. Smereka, and S. Osher, 1994, A level set approach for computing solutions to incompressible two-phase flow, J. Comput. Phys. 114, 146-159.
18. Taylor, H, Y. C. Lam, and D. Boning, 2009, A computationally simple method for simulating the micro-embossing of thermoplastic layers, J. Micromech. Microeng. 19, 075007.
19. Worgull, M. and M. Heckele, 2004, New aspects of simulation in hot embossing, Microsyst. Technol. 10, 432-437.
20. Worgull, M., J. F. Hétu, K. K. Kabanemi, and M. Heckele, 2006, Modeling and optimization of the hot embossing process for micro- and nanocomponent fabrication, Microsyst. Technol. 12, 947-952.
21. Yao, D., V. L. Virupaksha, and B. Kim, 2005, Study on squeezing flow during nonisothermal embossing of polymer microstructures, Polym. Eng. Sci. 45, 652-660.