Modeling and optimization of the hot embossing process for micro- and nanocomponent fabrication

Microsystem Technologies

Volumn 12, Issue 10-11, 2006, Pages 947-952

  Worgull, M ^a   Hetu J F ^b   Kabanemi, K K ^b   Heckele, M ^a  

^a KARLSRUHE INSTITUTE OF TECHNOLOGY   (Germany)

^b NATIONAL RESEARCH COUNCIL CANADA   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

MICROSTRUCTURE; NANOSTRUCTURED MATERIALS; OPTIMIZATION; POLYMERS; PROCESS CONTROL;

HOT EMBOSSING; MICROCOMPONENTS; VISCOELASTIC MATERIAL MODEL;

MOLDING;

EID: 33747615931     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-006-0124-0     Document Type: Conference Paper

References (9)

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3. Hanemann T, Heckele M, Plotter V (2000) Current status of micromolding technology. Polymer News 25:224-229
4. Heckele M, Schomburg WK (2004) Review on micro molding of thermoplastic polymers. J Micromech Microeng 14:R1-R14
5. Heckele M, Bacher W, Hanemann T, Ulrich H (1997) Hot embossing and injection molding for microoptical components. In: SPIE Conference, San Diego
6. Herzinger S (2004) High precision hot embossing, Kunststoffe 10
7. Worgull M, Heckele M (2004) New aspects of simulation in hot embossing. Microsystem Technol 10:432-437
8. Worgull M, Heckele M, Schomburg WK (2003) Analysis of the micro hot embossing process, Forschungszentrum Karlsruhe, FZKA-Bericht 6922
9. Worgull M, Heckele M, Schomburg W (2004) Large scale hot embossing. In: DTIP Conference Montreux