Advanced thermal packaging for high power TR modules

IEEE National Radar Conference - Proceedings

Volumn , Issue , 2011, Pages 985-988

  Hoffman, James Patrick ^a   Del Castillo, Linda ^a   Jenabi, Masud ^a   Miller, Jennifer ^a   Birur, Gajanana ^a  

^a CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ECOSYSTEM STRUCTURE; HARDWARE RELIABILITY; HIGH POWER ELECTRONICS; HIGH-POWER; OUTPUT POWER DENSITY; PACKAGING TECHNOLOGIES; POWER DENSITIES; STANDARD TECHNOLOGY;

IMAGING SYSTEMS; PACKAGING; POWER ELECTRONICS; STORMS;

SYNTHETIC APERTURE RADAR;

EID: 80052438016     PISSN: 10975659     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/RADAR.2011.5960683     Document Type: Conference Paper

References (10)

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