Advanced housing materials for extreme space applications

IEEE Aerospace Conference Proceedings

Volumn , Issue , 2011, Pages

  Del Castillo, Linda ^a   Hoffman, James P ^a   Birur, Gaj ^a  

^a CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

A-COEFFICIENT; A-DENSITY; ACTIVE DEVICES; ELECTRONIC HOUSING; GAAS; HEAT DISSIPATION; HOUSING MATERIALS; HYBRID CIRCUIT; MECHANICAL BEHAVIOR; MECHANICAL INTEGRITY; RF MODULE; SI-AL ALLOYS; SIGNIFICANT IMPACTS; SPACE-BASED; SPRAY-DEPOSITED;

ALUMINUM; DEPOSITS; HOUSING; HYBRID MATERIALS; SILICON; SILICON ALLOYS; SPACE APPLICATIONS; STRESSES; THERMAL CONDUCTIVITY;

THERMAL EXPANSION;

EID: 79955755503     PISSN: 1095323X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/AERO.2011.5747467     Document Type: Conference Paper

References (9)

1. A.L.Udovskii, V.N.Karpushkin, and E.A.Kozodaeva, General algorithm, its mathematical basis and computer autonomic program for calculation of phase diagrams of binary systems, containing p disordered phases of variable and q phases of constant compositions at (p,q) < 10, Calphad, Vol. 19, 1995, 245-277.
2. P. Villars, editor-in-chief; H. Okamoto and K. Cenzual, section editors, ASM Alloy Phase Diagrams Center.
3. S. P. S. Sangha, D. MI Jacobson, A. J. W. Ogilvy, M. Azema, A. Arun Junai and E. Botter, "Novel Aluminium-Silicon Alloys for Electronics Packaging," Engineering Science and Education Journal, 195-201, October 1997.
4. Osprey Controlled Expansion Alloys Material Datasheets.
5. J. Pavio and D. Hyde, "Effects of Coefficient of Thermal Expansion Mismatch on Solder Attached GaAs MMICs," IEEE MTT-S Digest, 1075-1078, 1991.
6. M. G. Pecht, R. Agarwal, P. McCluskey, T. Dishongh, S. Javadpoir, and R. Mahajan, Electronic Packaging Materials and Their Properties, CRC Press, Boca Raton, FL, 1999.
7. D.M. Jacobson, A.J.W. Ogilvy and A.G. Leatham, "Applications of Osprey Lightweight Controlled Expansion (CE) Alloys," 2005.
8. D.M. Jacobson and A.J.W. Ogilvy, "Spray-Deposited Al-Si (Osprey CE) Alloys and their Properties," Materialwissenschaft und Werkstofftechnik, Volume 34, Issue 4, pages 381-384, April 2003
9. S. Sangha, "Evaluation Report For Al-Si (CE9) Alloy for ARTES 4 L & S Band Solid State Power Amplifier," EADS Astrium Report A4W.RP.00002.DP.S.ASTR, Issue 02 Rev 00, 2006.