Remote heat sink concept for high power heat rejection

IEEE Transactions on Components and Packaging Technologies

Volumn 25, Issue 4, 2002, Pages 608-614

  Webb, Ralph L ^a   Yamauchi, Shinobu ^b   Denko, S ^c   Tochigi, K K ^c  

^a The Pennsylvania State University   (United States)

^b Showa Denko Materials Co   (Japan)

^c NONE

Author keywords

Cooling device; Heat exchanger; Heat sink; Thermal resistance; Thermo syphon

Indexed keywords

COOLING SYSTEMS; HEAT RESISTANCE; HEAT TRANSFER COEFFICIENTS; PERSONAL COMPUTERS; SERVERS; SURFACE ROUGHNESS;

COOLING DEVICES;

HEAT SINKS;

EID: 0036999971     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2003.809109     Document Type: Conference Paper

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