Assembly technology using lead-free solder

Fujitsu Scientific and Technical Journal

Volumn 43, Issue 1, 2007, Pages 50-58

  Yamamoto, Tsuyoshi ^a,b   Tsubone, Ken Ichiro ^a,c  

^a FUJITSU LABORATORIES LTD   (Japan)

^b International Microelectronics and Packaging Society (IMAPS)   (United States)

^c Japan Institute of Electronics Packaging JIEP   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

FUJITSU (CO); HAZARDOUS SUBSTANCES IN ELECTRICAL AND ELECTRONIC EQUIPMENT (ROHS); LEAD-FREE SOLDER; TIN-SILVER-COPPER;

ASSEMBLY; ELECTRONIC EQUIPMENT; ELECTRONICS ENGINEERING; LEAD; SOLDERING ALLOYS;

LAWS AND LEGISLATION;

EID: 33847016800     PISSN: 00162523     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (9)

1. IPC/JEDEC J-STD-020C: Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices. 2004. JEDEC | FREE Download Area | J-STD-020C. http://www.jedec.org/download/search/jstd020c.pdf
2. H. Uchida et al.: Thermal Analysis of Printed Circuit Boards for Infrared Reflow Soldering. 1998 International Symposium on Microelectronics (IMAPS1998), San Diego, 1998, p.63-68.
3. M. Ochiai et al.: Reliability of Solder Joints Assembled with Lead-Free Solder. FUJITSU Sci. Tech. J., 38, 1, p.96-101 (2002).
4. H. Yagi et al.: Lead-Free Solders Property and Reliability of Electronics Packaging, (in Japanese), M&M2002, JSME, Yamaguchi, 2002, p.225-226.
5. M. Kitajima et al.: Development of Sn-Zn-Al Lead-Free Solder Alloys. FUJITSU Sci. Tech. J., 41, 2, p.225-235 (2005).
6. T. Yamamoto et al.: The Development of Assembly Technology for Lead-free Low Temperature Solder. HDI2000, IMAPS/CMP, Denver, 2000, p.269-273.
7. N. Hidaka, et al.: Creep Properties and Micro-structure of the Sn-Ag-Cu-Ni-Ge Lead-Free Solder Alloy. InterPACK'05, ASME, San Francisco, 2005, IPACK2005-73148.
8. S. Saitoh et al.: Application of Blocked Carboxylic Acid to Electro Chemical Materials of Soldering (Report II). (in Japanese), 10th Symposium on "Microjoining and Assembly Technology in Electronics" (Mate2004), JWS, Yokohama, 2004, p.51-56.
9. K. Suganuma et al.: Low Temperature Soldering Project of JEITA. IPC/Soldertec 3rd International Lead Free Conference, IPC/Soldertec Global, Barcelona, 2005.