Effect of the temperature gradient, growth rate, and the interflake spacing on the microhardness in the directionally solidified Al-Si eutectic alloy

Journal of Materials Engineering and Performance

Volumn 12, Issue 5, 2003, Pages 544-551

  Kaya, H ^a   Cadirli E ^a   Gunduz M ^b   Ulgen A ^b  

^a NIGDE UNIVERSITY   (Turkey)

^b ERCIYES UNIVERSITY   (Turkey)

Author keywords

Al Si eutectic alloy; Hall Petch relationships; Interflake spacings; Microhardness

Indexed keywords

COMPOSITION; EUTECTICS; MICROHARDNESS; REGRESSION ANALYSIS; SILICON; SOLIDIFICATION; TEMPERATURE; THERMAL GRADIENTS; VACUUM FURNACES;

GROWTH RATE; HALL-PETCH TYPE RELATIONSHIPS; INTERFLAKE SPACING; TEMPERATURE GRADIENTS; VACUUM MELTING FURNACE;

ALUMINUM ALLOYS;

EID: 0242334177     PISSN: 10599495     EISSN: None     Source Type: Journal    
DOI: 10.1361/105994903100277201     Document Type: Article

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