Numerical prediction of mechanical properties of Pb-Sn solder alloys containing antimony, bismuth and or silver ternary trace elements

Journal of Electronic Materials

Volumn 29, Issue 12, 2000, Pages 1392-1397

  Gadag, Shiva P ^a   Patra, Susant ^a,b  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b Optical Micro Machines Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; ANTIMONY; BISMUTH; CRACKS; LEAD ALLOYS; MATHEMATICAL MODELS; METALLOGRAPHIC MICROSTRUCTURE; SILVER; SOLDERED JOINTS; STRAIN RATE; TENSILE PROPERTIES; TRACE ELEMENTS;

THERMAL FATIGUE;

SOLDERING ALLOYS;

EID: 0034505841     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-000-0124-2     Document Type: Article

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