Applications of novel high-aspect-ratio ultrathick UV photoresist for microelectroplating

Journal of Microelectromechanical Systems

Volumn 20, Issue 4, 2011, Pages 794-796

  Staab, Matthias ^a   Greiner, Felix ^a   Schlosser, Michael ^a   Schlaak, Helmut F ^a  

^a DARMSTADT UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

Microelectroplating; negative photoresists SU 8 versus AZ 125 nXT; UV LIGA; wet removal

Indexed keywords

ACID COPPER ELECTROLYTE; HIGH ASPECT RATIO; METAL STRUCTURES; MICROELECTROPLATING; NEGATIVE PHOTORESISTS; NEUTRAL NICKEL; RAPID PROCESSING; REACTIVE RADICALS; ROOM TEMPERATURE; SI SUBSTRATES; UV LIGA; UV PHOTORESIST; WET REMOVAL;

ACETONE; DIMETHYL SULFOXIDE; ELECTROFORMING; ELECTROLYTES; PHOTORESISTS;

ASPECT RATIO;

EID: 79961210631     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2011.2159098     Document Type: Article

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