Ultra-high I/O density glass/silicon interposers for high bandwidth smart mobile applications

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2011, Pages 217-223

  Kumar, Gokul ^a   Bandyopadhyay, Tapobrata ^a   Sukumaran, Vijay ^a   Sundaram, Venky ^a   Lim, Sung Kyu ^a   Tummala, Rao ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3-D ICS; COMPARATIVE STUDIES; DATA PATHS; DATA RATES; ELECTRICAL MODELING; EYE DIAGRAMS; FREQUENCY AND TIME DOMAINS; HIGH BANDWIDTH; LOGIC IC; LOWER COST; LOWER-POWER CONSUMPTION; MEMORY CAPACITY; MOBILE APPLICATIONS; PACKAGE CONFIGURATIONS; SIGNAL PATHS; THIN GLASS; ULTRA-HIGH; ULTRA-THIN;

ELECTRONICS PACKAGING; FREQUENCY DOMAIN ANALYSIS; GLASS; MOBILE DEVICES; THREE DIMENSIONAL; TIME DOMAIN ANALYSIS;

BANDWIDTH;

EID: 79960430006     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2011.5898516     Document Type: Conference Paper

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