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Volumn , Issue , 2010, Pages
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3D substrate innovation for complex high pin count flip-chip applications
a a
a
STC Madison
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(United States)
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Author keywords
[No Author keywords available]
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Indexed keywords
3-D SUBSTRATE;
ARRAY PATTERNS;
CONTACT PATTERN;
DIRECT CHIP ATTACHMENTS;
FLIP CHIP;
FLIP CHIP APPLICATIONS;
GLASS/EPOXY;
HIGH TEMPERATURE;
HIGH-DENSITY;
LITHOGRAPHIC PROCESS;
METALLIZATIONS;
MULTIPLE FUNCTION;
PB-FREE;
PIN COUNTS;
PRODUCT PERFORMANCE;
SOLDER BUMP;
SOLDER PROCESS;
SPEED PROCESSORS;
SUBSTRATE INTERFACE;
WAFER LEVEL;
WIREBOND;
DIES;
FLIGHT DYNAMICS;
FLIP CHIP DEVICES;
SOLDERING;
WIRE PRODUCTS;
SUBSTRATES;
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EID: 78651344071
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/ESTC.2010.5642880 Document Type: Conference Paper |
Times cited : (1)
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References (4)
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