Packaging with liquid crystal polymer

IEEE Microwave Magazine

Volumn 12, Issue 5, 2011, Pages 83-91

  Pham, Anh Vu ^a  

^a University of California   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRICAL INTERCONNECTIONS; ELECTRICAL LOSS; ELECTRONICS PACKAGE; HIGH FREQUENCY; PACKAGED DEVICE; PLASTIC PACKAGES; THERMAL DISSIPATION;

LIQUID CRYSTALS; LOSS PREVENTION;

METAL CLADDING;

EID: 79960283966     PISSN: 15273342     EISSN: None     Source Type: Trade Journal    
DOI: 10.1109/MMM.2011.941416     Document Type: Article

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