DC-50 GHz low loss thermally enhanced low cost LCP package process utilizing micro via technology

IEEE MTT-S International Microwave Symposium Digest

Volumn , Issue , 2006, Pages 961-964

  Aboush, Z ^a   Benedikt, J ^a   Priday, J ^b   Tasker, P J ^a  

^a CARDIFF UNIVERSITY   (United Kingdom)

^b Labtech Limited   (United Kingdom)

Author keywords

Broadband communication; Calibration; Ceramics; Laser machining; Microstrip; MMICs; Packaging

Indexed keywords

BROADBAND COMMUNICATION; LASER MACHINING; SIGNAL TRANSITION;

CHIP SCALE PACKAGES; COMPUTER SIMULATION; ELECTRIC LINES; ELECTRIC LOSSES; FREQUENCY BANDS; THERMAL CONDUCTIVITY;

LIQUID CRYSTAL POLYMERS;

EID: 34250367049     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MWSYM.2006.249877     Document Type: Conference Paper

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