Development of multilayer organic modules for hermetic packaging of RF MEMS circuits

IEEE MTT-S International Microwave Symposium Digest

Volumn , Issue , 2006, Pages 271-274

  Chen, Morgan ^a   Pham, Anh Vu ^a   Kapusta, Chris ^b   Iannotti, Joe ^b   Kornrumpf, William ^b   Evers, Nicole ^b   Maciel, John ^c   Karabudak, Nafiz ^d  

^a University of California Davis   (United States)

^b GE GLOBAL RESEARCH   (United States)

^c Radant MEMS Incorporated   (United States)

^d LOCKHEED MARTIN   (United States)

Author keywords

Hermeticity; Liquid crystal polymer; Phase shifter

Indexed keywords

CHIP SCALE PACKAGES; FREQUENCY BANDS; INSERTION LOSSES; LOW TEMPERATURE OPERATIONS; MULTILAYERS; PHASE SHIFTERS;

HERMETICALLY SEALED PACKAGES; HERMETICITY;

MEMS;

EID: 34250328329     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MWSYM.2006.249485     Document Type: Conference Paper

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