LCP injection molded packages - Keys to JEDEC 1 performance

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2004, Pages 1807-1811

  Ross, Richard J ^a  

^a RJR Polymers   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE BONDS; CAVITY PACKAGES; MAGIC BULLETS; PACKAGE ASSEMBLY PROCESS;

ADHESION; CHARGE COUPLED DEVICES; CMOS INTEGRATED CIRCUITS; HIGH TEMPERATURE EFFECTS; HUMIDITY CONTROL; INJECTION MOLDING; INTERFACIAL ENERGY; THERMOPLASTICS;

LIQUID CRYSTAL POLYMERS;

EID: 10444235673     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. U.S. Patent Number 6,214,152, "Lead Frame Moisture Barrier for Molded Plastic Electronic Packages." April 10, 2001
2. U.S. Patent Number 5,816,158, "Inverted Stamping Process." October 6, 1998
3. Ross, Richard J., "Plastic Cavity Packages for Microwave Devices Using Standard Eutectic Die Attach", Proceedings of the Wireless Design Conference, London England, May 15-17, 2002.
4. Ross, Richard J., "New Hydrophobie Materials and Process for Sealing Microwave and Vision Packages", Proceedings of the Wireless Design Conference, London, England, May 15-17, 2002.
5. FLH426A4N High Power 5.8 GHz Amplifier data sheet, SatCon Electronics, Marlboro, MA; 508-485-6350
6. U.S Patent Number 6,511,866, "Use of Deverse Materials in Air Cavity Packaging of Electronic Devices", January 28, 2003