RF characteristics of thin film liquid crystal polymer (LCP) packages for RF MEMS and MMIC integration

IEEE MTT-S International Microwave Symposium Digest

Volumn 2005, Issue , 2005, Pages 857-860

  Thompson, Dane ^a   Kingsley, Nickolas ^a   Wang, Guoan ^a   Papapolymerou, John ^a   Tentzeris, Manos M ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Interconnect; Laser machining; LCP; MEMS; Organic; Package; RF module; System on package

Indexed keywords

DIELECTRIC DISCONTINUITIES; LASER MACHINING; SYSTEM LEVEL PACKAGE; SYSTEM ON PACKAGE;

DIELECTRIC AMPLIFIERS; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; RADIO FREQUENCY AMPLIFIERS; THIN FILMS;

LIQUID CRYSTAL POLYMERS;

EID: 33746290593     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MWSYM.2005.1516753     Document Type: Conference Paper

References (7)

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