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Volumn 82, Issue 6, 2011, Pages

High-throughput characterization of stresses in thin film materials libraries using Si cantilever array wafers and digital holographic microscopy

(4) Lai, Y W a Hamann, S a Ehmann, M a Ludwig, A a

a RUHR UNIVERSITY BOCHUM (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CANTILEVER ARRAYS; CHARACTERIZATION METHODS; DIGITAL HOLOGRAPHIC MICROSCOPY; EQUATION BASED; HIGH THROUGH-PUT CHARACTERIZATION; HIGH-THROUGHPUT; LASER SCANNING; LOCAL STRESS; MATERIALS LIBRARIES; NANO-METER-SCALE; OUT-OF-PLANE RESOLUTION; RADII OF CURVATURE; SHAPE-MEMORY MATERIALS; SILICON ON INSULATOR WAFERS; STRESS STATE; STRESS-DEPENDENT; THIN FILM MATERIAL; TRANSLATION STAGE;

DEPOSITION; DIGITAL LIBRARIES; FILM THICKNESS; INSTRUMENTS; LIBRARIES; MATERIALS; NANOCANTILEVERS; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; STRESS MEASUREMENT; SURFACE TOPOGRAPHY; THIN FILMS; THROUGHPUT; TOPOGRAPHY; VAPOR DEPOSITION;

CHARACTERIZATION;

EID: 79960186810 PISSN: 00346748 EISSN: None Source Type: Journal
DOI: 10.1063/1.3600594 Document Type: Article

Times cited : (14)

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