Interface flow mechanism for tin whisker growth

Acta Materialia

Volumn 59, Issue 5, 2011, Pages 1957-1963

  Howard, H P ^a   Cheng, J ^b   Vianco, P T ^c   Li, J C M ^a,b  

^a University of Rochester   (United States)

^b UNIVERSITY OF ROCHESTER   (United States)

^c SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

Coatings; Crystal; Growth; Interfaces; Whiskers

Indexed keywords

DEVICE FAILURES; GROWTH; INTERFACE FLOW; INTERFACES; METAL FILAMENTS; NUCLEATION AND GROWTH; RAPID GROWTH; SHORT CIRCUIT; TIN COATING; TIN WHISKER; TRANSPORT MECHANISM; VISCOUS LAYERS; WHISKER FORMATION; WHISKERS;

CRYSTAL WHISKERS; MICROELECTRONICS; TIN;

COATINGS;

EID: 79551498430     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2010.11.061     Document Type: Article

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