Electroless plating of copper on surface-modified glass substrate

Applied Surface Science

Volumn 257, Issue 18, 2011, Pages 8067-8071

  Su, Wei ^a   Yao, Libei ^a   Yang, Fang ^a   Li, Peiyuan ^b   Chen, Juan ^a   Liang, Lifang ^a  

^a GUANGXI TEACHERS EDUCATION UNIVERSITY   (China)

^b GUANGXI UNIVERSITY OF CHINESE MEDICINE   (China)

Author keywords

Amine modification; Copper; Electroless deposition; Glass substrate

Indexed keywords

ATOMIC FORCE MICROSCOPY; COPPER; CROSSLINKING; ELECTROLESS PLATING; PALLADIUM; SCANNING ELECTRON MICROSCOPY; SUBSTRATES; X RAY DIFFRACTION;

AMINE MODIFICATION; COPPER DEPOSITION; CROSS LINKING AGENTS; ELECTROLESS COPPER DEPOSITION; GLASS SUBSTRATES; POLYETHYLENIMINES; SCANNING ELECTRON MICROSCOPY IMAGE; SURFACE-MODIFIED;

GLASS;

EID: 79957928259     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2011.04.100     Document Type: Article

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