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Volumn 18, Issue 25, 2002, Pages 9625-9628

Orthogonal self-aligned electroless metallization by molecular self-assembly

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; COMPLEXATION; ELECTROLESS PLATING; GOLD; GROWTH (MATERIALS); MOLECULAR DYNAMICS; NICKEL; ORGANIC COMPOUNDS; PALLADIUM; PASSIVATION; SCANNING ELECTRON MICROSCOPY; SELF ASSEMBLY;

EID: 0037059165     PISSN: 07437463     EISSN: None     Source Type: Journal    
DOI: 10.1021/la0260988     Document Type: Article
Times cited : (7)

References (45)
  • 1
    • 0003835724 scopus 로고
    • American Electroplaters and Surface Finishers Society: Orlando, Fl
    • Electroless plating: fundamentals and applications; American Electroplaters and Surface Finishers Society: Orlando, Fl, 1990.
    • (1990) Electroless Plating: Fundamentals and Applications


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.