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Volumn 12, Issue 8, 2011, Pages 1414-1421
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Highly reliable Si3N4-HfO2 stacked heterostructure to fully flexible poly-(3-hexylthiophene) thin-film transistor
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Author keywords
Fully flexible electronics; P3HT; Passivation layer; Sol gel process
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Indexed keywords
CARRIER MOBILITY;
COATINGS;
COST EFFECTIVENESS;
DRAIN CURRENT;
ELECTRIC FIELDS;
FLEXIBLE ELECTRONICS;
HAFNIUM OXIDES;
HIGH-K DIELECTRIC;
METAL INSULATOR BOUNDARIES;
MIM DEVICES;
PASSIVATION;
SILICON NITRIDE;
SOL-GEL PROCESS;
SUBSTRATES;
THIN FILM CIRCUITS;
THIN FILMS;
THRESHOLD VOLTAGE;
CURRENT ELECTRIC FIELD CHARACTERISTICS;
ELECTRICAL PERFORMANCE;
ELECTRICAL RELIABILITY;
ENVIRONMENTAL STABILITY;
METAL INSULATOR METALS;
P3HT;
PASSIVATION LAYER;
POLY (3-HEXYLTHIOPHENE);
THIN FILM TRANSISTORS;
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EID: 79957919976
PISSN: 15661199
EISSN: None
Source Type: Journal
DOI: 10.1016/j.orgel.2011.05.011 Document Type: Article |
Times cited : (15)
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References (20)
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