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Journal of Alloys and Compounds

Volumn 509, Issue 5, 2011, Pages

Sn whisker growth in Sn-9Zn-0.5Ga-0.7Pr lead-free solder

(7) Ye, Huan a Xue, Songbai a Zhang, Liang a Xiao, Zhengxiang a Hu, Yuhua a Lai, Zhongmin a,b Zhu, Hong a,c

a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS (China)

b JIANGSU UNIVERSITY OF SCIENCE AND TECHNOLOGY (China)

c CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION (China)

Author keywords

Driving force; Lead free solder; Sn whisker; Sn Zn

Indexed keywords

BINARY ALLOYS; CRYSTAL WHISKERS; GALLIUM ALLOYS; PRASEODYMIUM ALLOYS; PRASEODYMIUM COMPOUNDS; TIN COMPOUNDS; ZINC ALLOYS;

AMBIENT CONDITIONS; BULK SOLDER; DRIVING FORCES; OXIDATION REACTIONS; SN WHISKER; SPONTANEOUS GROWTH; WHISKER FORMATION; WHISKER GROWTH;

LEAD-FREE SOLDERS;

EID: 78651347079 PISSN: 09258388 EISSN: None Source Type: Journal
DOI: 10.1016/j.jallcom.2010.09.189 Document Type: Letter

Times cited : (24)

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